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公开(公告)号：EP1260607A3
公开(公告)日：2004-04-21
申请号：EP02253442.4
申请日：2002-05-15
申请人： Shipley Company LLC
CPC分类号： H05K3/244 , C23C18/1637 , C23C18/1834 , C23C18/42 , C23C18/54
摘要： The present invention discloses compositions for increasing the adhesion of a layer of silver deposited from an immersion plating bath as well as methods of increasing the adhesion of silver layers obtained using these compositions. Such compositions and methods are particularly useful in the manufacture of electronic devices.
摘要翻译： 本发明公开了用于增加浸渍镀浴中沉积的银层的粘附性的组合物，以及增加使用这些组合物获得的银层的粘附性的方法。 这样的组合物和方法在电子设备的制造中特别有用。
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公开(公告)号：EP1418251A1
公开(公告)日：2004-05-12
申请号：EP03255295.2
申请日：2003-08-26
申请人： Shipley Company LLC
摘要： The present invention provides compositions and methods for immersion depositing highly adherent silver layers. The compositions contain silver ions, water and a carboxylic acid-substituted nitrogen-containing heterocyclic compound. Such compositions and methods are particularly useful in the manufacture of electronic devices.
摘要翻译： 本发明提供用于浸渍沉积高度附着的银层的组合物和方法。 该组合物含有银离子，水和羧酸取代的含氮杂环化合物。 这样的组合物和方法在电子器件的制造中特别有用。
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公开(公告)号：EP0883331A3
公开(公告)日：2001-08-16
申请号：EP98109457.6
申请日：1998-05-25
申请人： Shipley Company LLC
摘要： A process for electroplating a substrate by coating the substrate with a coating of carbonaceous particles. The process is characterized by a pretreatment sequence that includes contact of the substrate with a single aqueous solution containing a reducing agent and a polyelectrolyte. The use of the single solution decreases the incidence of interconnect defects in printed circuit manufacture.
摘要翻译： 通过用碳质颗粒涂层涂覆基材来电镀基材的方法。 该方法的特征在于预处理程序，该程序包括底物与含有还原剂和聚电解质的单一水溶液的接触。 单一解决方案的使用降低了印刷电路制造中互连缺陷的发生率。
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公开(公告)号：EP1416065A1
公开(公告)日：2004-05-06
申请号：EP03255292.9
申请日：2003-08-26
申请人： Shipley Company LLC
摘要： The present invention provides compositions and methods for electroless deposition of bright silver layers of uniform thickness. The compositions contain silver ions, water, one or more complexing agents and one or more carboxylic acid-substituted nitrogen-containing heterocyclic compound. Such compositions and methods are particularly useful in the manufacture of electronic devices.
摘要翻译： 本发明提供用于无电沉积均匀厚度的亮银层的组合物和方法。 该组合物含有银离子，水，一种或多种络合剂和一种或多种羧酸取代的含氮杂环化合物。 这样的组合物和方法在电子器件的制造中特别有用。
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公开(公告)号：EP1260607A2
公开(公告)日：2002-11-27
申请号：EP02253442.4
申请日：2002-05-15
申请人： Shipley Company LLC
CPC分类号： H05K3/244 , C23C18/1637 , C23C18/1834 , C23C18/42 , C23C18/54
摘要： The present invention discloses compositions for increasing the adhesion of a layer of silver deposited from an immersion plating bath as well as methods of increasing the adhesion of silver layers obtained using these compositions. Such compositions and methods are particularly useful in the manufacture of electronic devices.
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