发明公开
EP1350759A2 Methods for embossing and bonding of PAEK for microfluidic devices
审中-公开
一种用于微流体装置的PAEK和压花接合方法
- 专利标题: Methods for embossing and bonding of PAEK for microfluidic devices
- 专利标题(中): 一种用于微流体装置的PAEK和压花接合方法
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申请号: EP02021747.7申请日: 2002-09-25
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公开(公告)号: EP1350759A2公开(公告)日: 2003-10-08
- 发明人: Roitman, Daniel B. , Killeen, Kevin P. , Seaward, Karen L. , Yin, Hongfeng , Robotti, Karla
- 申请人: Agilent Technologies Inc. (a Delaware Corporation)
- 申请人地址: 395 Page Mill Road Palo Alto, CA 94306-2024 US
- 专利权人: Agilent Technologies Inc. (a Delaware Corporation)
- 当前专利权人: Agilent Technologies Inc. (a Delaware Corporation)
- 当前专利权人地址: 395 Page Mill Road Palo Alto, CA 94306-2024 US
- 代理机构: Schoppe, Fritz, Dipl.-Ing.
- 优先权: US114801 20020402
- 主分类号: B81C1/00
- IPC分类号: B81C1/00 ; B29C59/02 ; B29C65/00 ; C09J179/08
摘要:
A fabrication and adhesion method for a polyaryl-ether-ketone (PAEK) device, such as a microfluidic device (400), is disclosed. At least one glassy uncrystallized PAEK substrate (250) is heated up to near or above the glass transition temperature to allow the substrate (250) to crystallize from the glass state, while embossing the substrate (250) with patterns (325). Bonding the PAEK substrate (250) to another substrate (255) is accomplished using a solvent-resistant adhesive (270), such as a polyimide-based adhesive, in combination with an adhesion enhancement treatment. In certain embodiments, the adhesion enhancement treatment is a plasma treatment or a chemical sulfonation treatment.
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