发明公开
EP1353374A1 Semiconductor chip assemblies, methods of making same and components for same
失效
Halbleiterchipanordnung und Verfahren zu Ihrer Herstellung
- 专利标题： Semiconductor chip assemblies, methods of making same and components for same
- 专利标题（中）： Halbleiterchipanordnung und Verfahren zu Ihrer Herstellung
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申请号： EP03076966.5申请日： 1991-09-24
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公开(公告)号： EP1353374A1公开(公告)日： 2003-10-15
- 发明人: Khandros, Igor Y. , Distefano, Thomas H.
- 申请人： TESSERA, INC.
- 申请人地址： 103 Fairview Park Drive Elmsford, NY 10523 US
- 专利权人： TESSERA, INC.
- 当前专利权人： TESSERA, INC.
- 当前专利权人地址： 103 Fairview Park Drive Elmsford, NY 10523 US
- 代理机构： Beresford, Keith Denis Lewis
- 优先权： US586758 19900924; US673020 19910321
- 主分类号： H01L23/13
- IPC分类号： H01L23/13
摘要：
A semiconductor chip assembly has a semiconductor chip (8420) having a front surface, the front surface including a central region and a peripheral region surrounding the central region, the chip having central contacts (8431) disposed in the central region of the front surface, a dielectric element (8436) overlying the chip front surface, and a plurality of terminals carried by the dielectric element for interconnection to a substrate. The dielectric element has a hole (8480) encompassing the central contacts, at least some of the terminals (8448) are central contact terminals overlying the chip front surface, and a plurality of central contact leads (8450) extend between the central contacts and the central contact terminals, the central contact leads being connected to the central contacts (8431) in the hole.
公开/授权文献
- EP1353374B1 Semiconductor chip assembly and method of making the same 公开/授权日：2007-01-24
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