发明授权
EP1372907B1 Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface during chemical-mechanical polishing
有权
装置和方法用于化学机械抛光过程中与半导体晶片的表面的活性保持器环的表面对准
- 专利标题： Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface during chemical-mechanical polishing
- 专利标题（中）： 装置和方法用于化学机械抛光过程中与半导体晶片的表面的活性保持器环的表面对准
-
申请号： EP02723724.7申请日： 2002-03-28
-
公开(公告)号： EP1372907B1公开(公告)日： 2006-11-29
- 发明人: SALDANA, Miguel A. , WILLIAMS, Damon, Vincent
- 申请人： LAM RESEARCH CORPORATION
- 申请人地址： 4650 Cushing Parkway Fremont, CA 94538 US
- 专利权人： LAM RESEARCH CORPORATION
- 当前专利权人： LAM RESEARCH CORPORATION
- 当前专利权人地址： 4650 Cushing Parkway Fremont, CA 94538 US
- 代理机构： Thomson, Paul Anthony
- 优先权： US823169 20010329
- 国际公布： WO2002078900 20021010
- 主分类号： B24B37/04
- IPC分类号： B24B37/04 ; B24B41/06
摘要：
A CMP system and methods reduce a cause of differences between an edge profile of a chemical mechanical polished edge of a wafer and a center profile of a chemical mechanical polished central portion of the wafer within the edge. The wafer is mounted on a carrier surface (210) of a wafer carrier (212) so that a wafer axis (224) of rotation is gimballed for universal movement relative to a spindle axis (218) of rotation of a wafer spindle (220) . A retainer ring (226) limits wafer movement on the carrier surface (210) perpendicular to the wafer axis. The retainer ring (226) is mounted on and movable relative to the wafer carrier (212) . A linear bearing (230) is configured with a housing (320) and a shaft (326) so that a direction of permitted movement between the wafer carrier (212) and the retainer ring (226) is only movement parallel to the wafer axis (224), so that a wafer plane and a retainer ring (226) may be co-planar.
公开/授权文献
信息查询
