发明公开
EP1424407A1 Plating bath for forming thin resistance layer, method of formation of resistance layer, conductive base with resistance layer, and circuit board material with resistance layer
有权
Herstellungsverfahrenfüreine NiP Widerstandsschicht durch elektrochemische Abscheidung
- 专利标题： Plating bath for forming thin resistance layer, method of formation of resistance layer, conductive base with resistance layer, and circuit board material with resistance layer
- 专利标题（中）： Herstellungsverfahrenfüreine NiP Widerstandsschicht durch elektrochemische Abscheidung
-
申请号： EP03027308.0申请日： 2003-11-26
-
公开(公告)号： EP1424407A1公开(公告)日： 2004-06-02
- 发明人: Matsuda, Akira , Suzuki, Yuuji , Otsuka, Hideo , Kikuchi, Yuuki , Matsumoto, Sadao
- 申请人： FURUKAWA CIRCUIT FOIL CO., LTD.
- 申请人地址： 8-9, Kandanishiki-cho 1 chome, Chiyoda-ku Tokyo 101-0054 JP
- 专利权人： FURUKAWA CIRCUIT FOIL CO., LTD.
- 当前专利权人： FURUKAWA CIRCUIT FOIL CO., LTD.
- 当前专利权人地址： 8-9, Kandanishiki-cho 1 chome, Chiyoda-ku Tokyo 101-0054 JP
- 代理机构： Benedum, Ulrich Max, Dr.
- 优先权： JP2002341813 20021126
- 主分类号： C25D3/12
- IPC分类号： C25D3/12 ; C25D5/02 ; H05K1/16
摘要：
A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.
公开/授权文献
信息查询
