发明授权
EP1442155B1 VERFAHREN ZUR BEHANDLUNG VON ELEKTRISCH LEITFÄHIGEN SUBSTRATEN WIE LEITERPLATTEN UND DERGLEICHEN
有权
METHOD FOR状电路板等导电性基板的处理
- 专利标题： VERFAHREN ZUR BEHANDLUNG VON ELEKTRISCH LEITFÄHIGEN SUBSTRATEN WIE LEITERPLATTEN UND DERGLEICHEN
- 专利标题（英）： Method for the treatment of electrically conductive substrates and printed circuit boards and the like
- 专利标题（中）： METHOD FOR状电路板等导电性基板的处理
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申请号： EP02774761.7申请日： 2002-10-31
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公开(公告)号： EP1442155B1公开(公告)日： 2009-12-09
- 发明人: FAUSER, Heidi , ZIELONKA, Andreas , SCHMID, Christian , ROGOLL, Volker , FREUDENBERGER, Renate
- 申请人： Gebr. Schmid GmbH & Co.
- 申请人地址： Robert-Bosch-Strasse 32-34 D-72250 Freudenstadt DE
- 专利权人： Gebr. Schmid GmbH & Co.
- 当前专利权人： Gebr. Schmid GmbH & Co.
- 当前专利权人地址： Robert-Bosch-Strasse 32-34 D-72250 Freudenstadt DE
- 代理机构： Patentanwälte Ruff, Wilhelm, Beier, Dauster & Partner
- 优先权： DE10154886 20011105
- 国际公布： WO2003041462 20030515
- 主分类号： C23F1/00
- IPC分类号： C23F1/00 ; C25F3/02 ; H05K3/07
摘要：
The invention relates to a method for the treatment of printed circuit boards, printed circuits and the like, wherein a metal, especially copper, is removed initially by pulsed electrochemical etching and is subsequently removed by chemical etching. As a result, anisotropic removal of the metal is possible and structures which are deeper than the width thereof are obtained.
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