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1.发明公开
公开(公告)号：EP1916670A3
公开(公告)日：2009-11-25
申请号：EP07119282.7
申请日：2007-10-25
申请人： Acreo AB
CPC分类号： H05K3/08 , H05K1/0393 , H05K3/02 , H05K3/061 , H05K3/07 , H05K2201/0329 , H05K2203/0117 , H05K2203/0121 , H05K2203/0143 , H05K2203/1142 , H05K2203/1545 , H05K2203/163
摘要： A method for monitoring a substrate patterning process, wherein at least two electrodes (2, 3) are used to apply a voltage to the substrate (1) to cause a reaction in a portion of the substrate, comprises recording a current driven by said voltage as a function of time and/or as a function of a position of the substrate (1) or a patterning mask.
Also disclosed are a device and a computer program product for monitoring the substrate patterning process.-
2.发明公开Verfahren zur Behandlung von elektrisch leitfähigen Substraten wie Leiterplatten und dergleichen 审中-公开治疗导电基底，例如印刷电路板等的方法
公开(公告)号：EP1309236A3
公开(公告)日：2004-04-07
申请号：EP02024160.0
申请日：2002-10-30
摘要： Bei einem Verfahren zur Behandlung von elektrisch leitfähigen Substraten wie Leiterplatten, gedruckten Schaltungen und dergleichen, bei dem vorzugsweise mindestens ein Metall in einem Elektrolyten durch ein elektrisches Feld, das zwischen dem Substrat und einer vorzugsweise kathodisch geschalteten Elektrode angelegt wird, mindestens teilweise elektrochemisch abgetragen wird, sind Bereiche des Substrats, insbesondere der Substratoberfläche, zeitweise gegen das elektrische Feld abgeschirmt.
摘要翻译： 阳极表面的区域中的金属去除筛选针对的电场在一段时间，。 一种独立claimsoft包括对应电解设备，其包括屏幕。
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3.发明授权
公开(公告)号：EP0154572B1
公开(公告)日：1989-07-26
申请号：EP85400162.5
申请日：1985-01-31
发明人： Solomon, Ionel , Meot, Jacques , Meligne, Patrick
CPC分类号： C25F3/14 , H05K3/08 , H05K2201/0326 , H05K2203/0121
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公开(公告)号：EP1948852B1
公开(公告)日：2018-08-29
申请号：EP06824464.9
申请日：2006-11-20
发明人： FREDENBERG, Mikael , MÖLLER, Patrik , WIWEN-NILSSON, Peter , ARONSSON, Cecilia , DAINESE, Matteo
IPC分类号： C25D5/02 , C25D21/08 , C25F3/14 , C25D7/12 , C25D21/11 , H01L21/768 , H01L21/288 , C25D5/10 , C25D1/00 , H05K3/24 , H05K3/46 , C25D5/50 , B81C99/00 , H01L21/3213 , H05K3/07 , H05K3/10
CPC分类号： C25D5/02 , B81C99/0085 , C23C14/34 , C23C14/3414 , C25D1/003 , C25D1/10 , C25D5/022 , C25D5/10 , C25D5/50 , C25D7/12 , C25D7/123 , C25F3/14 , H01L21/2885 , H01L21/32134 , H01L21/76838 , H01L21/76843 , H01L21/76852 , H01L21/76873 , H01L21/76877 , H01L21/76885 , H05K3/07 , H05K3/108 , H05K3/241 , H05K3/4647 , H05K2203/0117 , H05K2203/0733 , Y10T156/10
摘要： An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material in an electrode layer (4) is applied in the cavities of the patterned insulating layer and in contact with the carrier. An connection layer (5) is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.
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公开(公告)号：EP2322694B1
公开(公告)日：2017-08-02
申请号：EP10182946.3
申请日：2002-06-17
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公开(公告)号：EP1948852A4
公开(公告)日：2016-10-12
申请号：EP06824464
申请日：2006-11-20
IPC分类号： C25D5/02 , B81C99/00 , C25D1/00 , C25D5/10 , C25D5/50 , C25D17/12 , C25D21/08 , C25D21/11 , C25F3/14 , H01L21/288 , H01L21/3213 , H01L21/768 , H05K3/07 , H05K3/10 , H05K3/24 , H05K3/46
CPC分类号： C25D5/02 , B81C99/0085 , C23C14/34 , C23C14/3414 , C25D1/003 , C25D1/10 , C25D5/022 , C25D5/10 , C25D5/50 , C25D7/12 , C25D7/123 , C25F3/14 , H01L21/2885 , H01L21/32134 , H01L21/76838 , H01L21/76843 , H01L21/76852 , H01L21/76873 , H01L21/76877 , H01L21/76885 , H05K3/07 , H05K3/108 , H05K3/241 , H05K3/4647 , H05K2203/0117 , H05K2203/0733 , Y10T156/10
摘要： An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material in an electrode layer (4) is applied in the cavities of the patterned insulating layer and in contact with the carrier. An connection layer (5) is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.
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7.发明公开Procédé de formation de circuits électriques en couche mince, outil pour la mise en oeuvre du procédé, et produits obtenus 失效制造薄膜电路，设备，用于执行该方法和制造的产品的方法。
公开(公告)号：EP0154572A2
公开(公告)日：1985-09-11
申请号：EP85400162.5
申请日：1985-01-31
发明人： Solomon, Ionel , Meot, Jacques , Meligne, Patrick
CPC分类号： C25F3/14 , H05K3/08 , H05K2201/0326 , H05K2203/0121
摘要： L'invention concerne la formation de circuits électriques composés d'une couche mince conductrice ou semi-conductrice déposée sur un substrat isolant électrique.
Selon l'invention, on forme les circuits par attaque au moyen d'un outil (4) d'électro-érosion de la couche mince déposée sur le substrat (2) de façon à y former des trajets isolés (5,6)
L'invention s'applique à la fabrication de circuits électriques en couche mince conductrice ou semi-conductrice.-
8.发明授权VERFAHREN ZUR BEHANDLUNG VON ELEKTRISCH LEITFÄHIGEN SUBSTRATEN WIE LEITERPLATTEN UND DERGLEICHEN 有权METHOD FOR状电路板等导电性基板的处理
公开(公告)号：EP1442155B1
公开(公告)日：2009-12-09
申请号：EP02774761.7
申请日：2002-10-31
CPC分类号： C25F3/02 , H05K3/06 , H05K3/07 , H05K2203/1476 , H05K2203/1492
摘要： The invention relates to a method for the treatment of printed circuit boards, printed circuits and the like, wherein a metal, especially copper, is removed initially by pulsed electrochemical etching and is subsequently removed by chemical etching. As a result, anisotropic removal of the metal is possible and structures which are deeper than the width thereof are obtained.
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公开(公告)号：EP1425948B1
公开(公告)日：2008-06-04
申请号：EP02798066.3
申请日：2002-09-09
申请人： Obducat Aktiebolag
摘要： Etching of copper on a card is achieved by applying an electrical voltage between a cathode (102) and the card (42), the card (42) thereby forming an anode. The cathode (102) and the card (42) are immersed in an electrolyte comprising a first component, which may be reduced from a first state in the form of an ion having a metal atom with a first positive oxidation number to a second state in the form of an ion having said metal atom with a second positive oxidation number, which is less than said first positive oxidation number. A first redox potential in the electrolyte for reduction from the first to the second state is larger than a second redox potential in the electrolyte for reduction of divalent copper ions to metallic copper. During the etching metallic copper on the card is oxidised and transferred into positively charged copper ions while the first component is reduced from its first state to its second state. The quality of the etched structures on the card is improved since no metallic copper is precipitated on the cathode.
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公开(公告)号：EP1425948A2
公开(公告)日：2004-06-09
申请号：EP02798066.3
申请日：2002-09-09
申请人： Obducat Aktiebolag
摘要： Etching of copper on a card is achieved by applying an electrical voltage between a cathode (102) and the card (42), the card (42) thereby forming an anode. The cathode (102) and the card (42) are immersed in an electrolyte comprising a first component, which may be reduced from a first state in the form of an ion having a metal atom with a first positive oxidation number to a second state in the form of an ion having said metal atom with a second positive oxidation number, which is less than said first positive oxidation number. A first redox potential in the electrolyte for reduction from the first to the second state is larger than a second redox potential in the electrolyte for reduction of divalent copper ions to metallic copper. During the etching metallic copper on the card is oxidised and transferred into positively charged copper ions while the first component is reduced from its first state to its second state. The quality of the etched structures on the card is improved since no metallic copper is precipitated on the cathode.
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