摘要:
In a method for treating substrates (13) for silicon solar cells, the substrates are cleaned with deionized water (18) following multiple etching processes. The substrates (13) are then dried and heated in drying stations (22, 25), whereupon the heated substrates (13) are oxidized in an oxidation station (30) by means of an oxidizing gas having a percentage of ozone.
摘要:
The invention relates to a method and device for treating silicon wafers. In a first step, the silicon wafers (22) are conveyed flat along a continuous, horizontal conveyor belt (12, 32) and nozzles (20) or the like spray an etching solution (21) from the top onto the wafers to texture them, only little etching solution (21) being applied to the silicon wafers (22) from below. In a second step, the silicon wafers (22), which are aligned as in the first step, are wetted exclusively from below with the etching solution (35) to etch-polish them.
摘要:
A system (11) is designed to coat a film-like, long carrier (18) for thin-film solar cells on the absorber layer thereof with cadmium sulfide. To this end, the carrier (18) is continuously guided through a solution (23) made of cadmium acetate, ammonia and thiourea or is immersed into a bath (22) with said solution (23). By using a wide, very long and flat tub (24) containing the solution (23), the required amount for the coating is minimized, such that the consumption of solution (23) is low.
摘要:
In a coating device (11) for coating a solar cell (12) with metal, for example copper, in a coating bath (16), light sources (20) are provided. By virtue of the light (22) from said light sources, the solar cells (12) become electrically conductive and can be coated with copper from the coating bath (16) when a voltage is applied. The light (22) from the light sources (20), which can advantageously be LEDs (21) has a colour or light wavelength which is chosen precisely such that it radiates as well as possible through the coating bath (16) or has minimum losses. In the case of copper, the light (22) is blue owing to the blue coating bath (16).
摘要:
In order to transport printed circuit boards (30) through a processing system (12), printed circuit boards (30) lying one behind another can be connected by means of holding clips (22) to form a type of chain. The outer ends of the holding clips (22) are suspended on two spaced-apart transport chains (16) which provide for transport and mounting. The holding clips are formed in two parts with a lower holding part (22) and an upper holding part (40), between which a printed circuit board (30) is mounted.
摘要:
The invention relates to a device for treating the surfaces of silicon wafers, comprising transport rollers for transporting the silicon wafer, and at least one conveyor device which wets the surface of the silicon wafer with an aqueous medium on a transport plane which is determined by the transport rollers. The conveyor device is configured such that it can apply the process medium to the surface of the silicon wafer, which is oriented in a downward manner and which is arranged on the transport plane. Several suction pipes for suctioning gaseous and/or mist-like distributed process mediums from the area surrounding the conveyor device are provided. The suction pipes are arranged in the vertical direction below the transport plane.
摘要:
In order to process a silicon wafer for a solar cell (11), an anti-reflective coating (15) on an active silicon layer (13) can be provided with trenches (22), for example by means of a laser (20a). The possibility of damage to the upper face (14) of the active layer (13) by the laser (20a) can be avoided by introducing a contact and doping material (30) into the trench (22). This material contains nickel for the contact function and phosphorus for the doping function. Heating of the contact and doping material (30), for example by means of a second laser (20b), results in doping of the adjacent area (25) of the active layer (13). This can thus be repaired and, in addition, a very low contact resistance can be produced to the finished contact (30’).
摘要:
The invention relates to a galvanising device (11) for circuit boards (16) with contact wheels (28) for electrical contacting provided at the boundary region (19). The contact wheels (28) only contact the underside (17) of the circuit board (16) in the boundary region (19). On the upper side (18) of the circuit board (16) only transport wheels (20) and counter-pressure wheels (31) to guarantee the electrical contact are provided. By the means of the exclusively underneath arrangement of contact wheels (28), copper shards or similar arising on coating the circuit board can easily fall away and be removed.