VERFAHREN UND VORRICHTUNG ZUR BEHANDLUNG VON SILIZIUM-WAFERN
    2.
    发明公开
    VERFAHREN UND VORRICHTUNG ZUR BEHANDLUNG VON SILIZIUM-WAFERN 有权
    方法和一种用于治疗硅片

    公开(公告)号:EP2232526A2

    公开(公告)日:2010-09-29

    申请号:EP08861689.1

    申请日:2008-12-18

    发明人: KAPPLER, Heinz

    IPC分类号: H01L21/00 B05C1/02 B05C1/08

    摘要: The invention relates to a method and device for treating silicon wafers. In a first step, the silicon wafers (22) are conveyed flat along a continuous, horizontal conveyor belt (12, 32) and nozzles (20) or the like spray an etching solution (21) from the top onto the wafers to texture them, only little etching solution (21) being applied to the silicon wafers (22) from below. In a second step, the silicon wafers (22), which are aligned as in the first step, are wetted exclusively from below with the etching solution (35) to etch-polish them.

    VORRICHTUNG UND VERFAHREN ZUR OBERFLÄCHENBEHANDLUNG VON SUBSTRATEN
    8.
    发明公开
    VORRICHTUNG UND VERFAHREN ZUR OBERFLÄCHENBEHANDLUNG VON SUBSTRATEN 有权
    装置和方法用于基材的表面处理

    公开(公告)号:EP1961035A1

    公开(公告)日:2008-08-27

    申请号:EP06829658.1

    申请日:2006-12-15

    发明人: KAPPLER, Heinz

    IPC分类号: H01L21/00 B05C1/08

    摘要: The invention relates to a device for treating the surfaces of silicon wafers, comprising transport rollers for transporting the silicon wafer, and at least one conveyor device which wets the surface of the silicon wafer with an aqueous medium on a transport plane which is determined by the transport rollers. The conveyor device is configured such that it can apply the process medium to the surface of the silicon wafer, which is oriented in a downward manner and which is arranged on the transport plane. Several suction pipes for suctioning gaseous and/or mist-like distributed process mediums from the area surrounding the conveyor device are provided. The suction pipes are arranged in the vertical direction below the transport plane.

    EINRICHTUNG ZUR BEHANDLUNG VON FLACHEN UND FLÄCHIGEN GEGENSTÄNDEN
    10.
    发明公开
    EINRICHTUNG ZUR BEHANDLUNG VON FLACHEN UND FLÄCHIGEN GEGENSTÄNDEN 审中-公开
    设备用于治疗平坦,扁平物体

    公开(公告)号:EP1899507A2

    公开(公告)日:2008-03-19

    申请号:EP06754450.2

    申请日:2006-06-20

    IPC分类号: C25D17/00 H05K3/24

    摘要: The invention relates to a galvanising device (11) for circuit boards (16) with contact wheels (28) for electrical contacting provided at the boundary region (19). The contact wheels (28) only contact the underside (17) of the circuit board (16) in the boundary region (19). On the upper side (18) of the circuit board (16) only transport wheels (20) and counter-pressure wheels (31) to guarantee the electrical contact are provided. By the means of the exclusively underneath arrangement of contact wheels (28), copper shards or similar arising on coating the circuit board can easily fall away and be removed.