发明公开
- 专利标题： Composite metal column for mounting semiconductor device
- 专利标题（中）： 用于半导体器件的安装金属的复合列
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申请号： EP03104978.6申请日： 2003-12-24
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公开(公告)号： EP1443548A3公开(公告)日： 2004-08-18
- 发明人: Tellkamp, John P , Matsunami, Akira
- 申请人： TEXAS INSTRUMENTS INCORPORATED
- 申请人地址： 13500 North Central Expressway , PO Box 655474 Dallas 75265 US
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： 13500 North Central Expressway , PO Box 655474 Dallas 75265 US
- 代理机构： Holt, Michael
- 优先权： US437593P 20021231; US437366P 20021231
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/00 ; H01L23/485 ; B23K3/06 ; B23K35/26 ; B23K35/02 ; H05K3/00
摘要：
An integrated circuit chip (903), which has a plurality of pads (903b) and non-reflowable contact members (1201) to be connected by reflow attachment to external parts. Each of these contact members (1201) has a height-to-diameter ratio and uniform diameter favorable for absorbing strain under thermomechanical stress. The members have a solderable surface (1202) on each end and a layer of reflowable material on each end. Each member is solder-attached (1204) at one end to a chip contact pad (903b), while the other end (1203) of each member is operable for reflow attachment to external parts.
公开/授权文献
- EP1443548A2 Composite metal column for mounting semiconductor device 公开/授权日：2004-08-04
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