公开(公告)号：EP1443548A3

公开(公告)日：2004-08-18

申请号：EP03104978.6

申请日：2003-12-24

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Tellkamp, John P ,  Matsunami, Akira

IPC分类号： H01L21/60 ,  H01L23/00 ,  H01L23/485 ,  B23K3/06 ,  B23K35/26 ,  B23K35/02 ,  H05K3/00

CPC分类号： H05K3/3436 ,  B23K3/0623 ,  B23K35/001 ,  B23K35/0222 ,  B23K35/0238 ,  B23K2201/40 ,  H01L23/562 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3463 ,  H05K2201/10242 ,  H05K2201/10992 ,  H05K2203/033 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2224/29099

摘要： An integrated circuit chip (903), which has a plurality of pads (903b) and non-reflowable contact members (1201) to be connected by reflow attachment to external parts. Each of these contact members (1201) has a height-to-diameter ratio and uniform diameter favorable for absorbing strain under thermomechanical stress. The members have a solderable surface (1202) on each end and a layer of reflowable material on each end. Each member is solder-attached (1204) at one end to a chip contact pad (903b), while the other end (1203) of each member is operable for reflow attachment to external parts.

公开(公告)号：EP1443548A2

公开(公告)日：2004-08-04

申请号：EP03104978.6

申请日：2003-12-24

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Tellkamp, John P ,  Matsunami, Akira

IPC分类号： H01L21/60 ,  H01L21/48

CPC分类号： H05K3/3436 ,  B23K3/0623 ,  B23K35/001 ,  B23K35/0222 ,  B23K35/0238 ,  B23K2201/40 ,  H01L23/562 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3463 ,  H05K2201/10242 ,  H05K2201/10992 ,  H05K2203/033 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2224/29099

摘要： An integrated circuit chip (903), which has a plurality of pads (903b) and non-reflowable contact members (1201) to be connected by reflow attachment to external parts. Each of these contact members (1201) has a height-to-diameter ratio and uniform diameter favorable for absorbing strain under thermomechanical stress. The members have a solderable surface (1202) on each end and a layer of reflowable material on each end. Each member is solder-attached (1204) at one end to a chip contact pad (903b), while the other end (1203) of each member is operable for reflow attachment to external parts.

摘要翻译： 一种集成电路芯片（903），其具有多个焊盘（903b）和不可回流的接触构件（1201），通过回流附接到外部部件来连接。 这些接触构件（1201）中的每一个都具有高的直径比和均匀的直径，以有利于在热机械应力下吸收应变。 这些构件在每个端部上具有可焊接表面（1202），并且在每个端部上具有可回流材料层。 每个构件在一端焊接（1204）到芯片接触垫（903b），而每个构件的另一端（1203）可操作用于回流附接到外部部件。