发明公开
EP1468439A4 METHOD FOR FABRICATING A HIGH VOLTAGE POWER MOSFET HAVING A VOLTAGE SUSTAINING REGION THAT INCLUDES DOPED COLUMNS FORMED BY RAPID DIFFUSION
有权
工艺生产具有张力UPRIGHT保护区的高压功率MOSFET通过快速的扩散MADE掺杂立柱INCLUDES
- 专利标题: METHOD FOR FABRICATING A HIGH VOLTAGE POWER MOSFET HAVING A VOLTAGE SUSTAINING REGION THAT INCLUDES DOPED COLUMNS FORMED BY RAPID DIFFUSION
- 专利标题(中): 工艺生产具有张力UPRIGHT保护区的高压功率MOSFET通过快速的扩散MADE掺杂立柱INCLUDES
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申请号: EP02792552申请日: 2002-12-30
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公开(公告)号: EP1468439A4公开(公告)日: 2009-01-07
- 发明人: BLANCHARD RICHARD A
- 申请人: GEN SEMICONDUCTOR INC
- 专利权人: GEN SEMICONDUCTOR INC
- 当前专利权人: GEN SEMICONDUCTOR INC
- 优先权: US3906801 2001-12-31
- 主分类号: H01L21/329
- IPC分类号: H01L21/329 ; H01L21/336 ; H01L29/06 ; H01L29/10 ; H01L29/739 ; H01L29/78
摘要:
A method for fabricating a high voltage power MOSFFT having a voltage sustaining region that includes doped columns formed by rapid diffusion. A high voltage semiconductor device having a substrate of a first or second conductivity type, an epitaxial layer of the first conductivity on the substrate, and a voltage sustaining region formed in the epitaxial layer, the voltage sustaining region including a column having a second conductivity type formed along at least outer sidewalls of a filled trench, the column including at least one first diffused region and a second diffused region, the first diffused region being connected by the second region and the second region having a junction depth measured from the trench sidewall that is less than the junction depth of the first region and a third region of a second conductivity type that extends from the surface of the epitaxial layer to intersect at least one of the first and second regions of second conductivity type.
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