发明公开
EP1510806A4 THREE-DIMENSIONAL STRUCTURAL BODY COMPOSED OF SILICON FINE WIRE, ITS MANUFACTURING METHOD, AND DEVICE USING SAME
审中-公开
三维结构体硅FEINDRAHT，工艺用于生产和设备
- 专利标题： THREE-DIMENSIONAL STRUCTURAL BODY COMPOSED OF SILICON FINE WIRE, ITS MANUFACTURING METHOD, AND DEVICE USING SAME
- 专利标题（中）： 三维结构体硅FEINDRAHT，工艺用于生产和设备
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申请号： EP03730767申请日： 2003-06-02
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公开(公告)号： EP1510806A4公开(公告)日： 2008-03-19
- 发明人: KAWAKATSU HIDEKI , KOBAYASHI DAI
- 申请人： JAPAN SCIENCE & TECH AGENCY
- 专利权人： JAPAN SCIENCE & TECH AGENCY
- 当前专利权人： JAPAN SCIENCE & TECH AGENCY
- 优先权： JP2002161140 2002-06-03; JP2003151255 2003-05-28
- 主分类号： G01G3/16
- IPC分类号： G01G3/16 ; B01J20/28 ; B81B1/00 ; B81C1/00 ; B82B1/00 ; B82B3/00 ; G01K7/16 ; G01L1/10 ; G01N1/00 ; G01Q30/10 ; G01Q30/20 ; G01Q60/24 ; G01Q60/38 ; G01Q60/54 ; G01R33/02 ; G01N13/16 ; B01D39/06 ; B01D39/20 ; G01B21/00 ; G02B5/18 ; G02B5/28 ; G12B21/08
摘要：
A highly-reliable three-dimensional structural body composed of a micro silicon fine wire, a method for manufacturing the three-dimensional structural body, and a device using the same. The three-dimensional structural body comprises a wire (2) of the order of nanometers to micrometers formed by wet-etching using the crystallinity of a single crystal material.
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