发明公开
EP1523037A2 Metal/ceramic bonding substrate and method for producing same
审中-公开
Metall / Keramik-Verbundsubstrat和Verfahren zu seiner Herstellung
- 专利标题： Metal/ceramic bonding substrate and method for producing same
- 专利标题（中）： Metall / Keramik-Verbundsubstrat和Verfahren zu seiner Herstellung
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申请号： EP04024192.9申请日： 2004-10-11
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公开(公告)号： EP1523037A2公开(公告)日： 2005-04-13
- 发明人: Osanai, Hideyo , Takahashi, Takayuki , Namioka, Makoto
- 申请人： Dowa Mining Co., Ltd.
- 申请人地址： 8-2, Marunouchi 1-chome, Chiyoda-ku Tokyo 100-8282 JP
- 专利权人： Dowa Mining Co., Ltd.
- 当前专利权人： Dowa Mining Co., Ltd.
- 当前专利权人地址： 8-2, Marunouchi 1-chome, Chiyoda-ku Tokyo 100-8282 JP
- 代理机构： Manitz, Finsterwald & Partner GbR
- 优先权： JP2003351936 20031010
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L23/14
摘要：
In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrate 12 to the metal base plate 16. The difference in level is provided by forming at least one of a rising portion 16a and a groove portion 116b on and in the metal base plate 16.
公开/授权文献
- EP1523037B1 Method for producing a metal/ceramic bonding substrate 公开/授权日：2020-03-18
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