A method for manufacturing a laminated board by continuously bonding a metal foil to a heat-resistant film having a fusion bondability, characterized in that the periphery of the laminated board is cooled to a temperature equal to or higher than that of the central part of the laminated board in the cooling process after the bonding. This method prevents the problem that the laminated board cannot be fixed at a circuit pattern forming step because of the waviness of the peripheral part of the laminated board, thus providing a laminated board with favorable appearance.