公开(公告)号：EP1193280A4

公开(公告)日：2002-07-31

申请号：EP00913104

申请日：2000-04-04

申请人： KANEKA CORP

发明人： TSUJI HIROYUKI ,  FURUTANI HIROYUKI ,  TANAKA KOICHIRO ,  KIKUCHI TAKESHI

IPC分类号： C08G73/10 ,  C08G73/14 ,  C09J7/00 ,  C09J7/02 ,  H05K1/03 ,  H05K3/38 ,  C08L63/00 ,  C08L79/08 ,  C09J179/08

CPC分类号： C08G73/1064 ,  C08G73/10 ,  C08G73/101 ,  C08G73/1032 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/14 ,  C09J7/10 ,  C09J7/22 ,  C09J7/25 ,  C09J7/35 ,  C09J2463/00 ,  C09J2479/08 ,  C09J2479/086 ,  H05K1/0346 ,  H05K3/386 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures. Specifically, the present invention provides a novel polyimide resin having low water absorption obtained by a reaction between tetracarboxylic acid dianhydride containing ester-acid dianhydride represented by the general formula (1): wherein X represents -(CH2)k-, or is a divalent group which comprises an aromatic ring, and k is an integer from 1 to 10; and aromatic diamine, where the resin composition and the film-state joining component which comprise a thermosetting resin with excellent adhesion using this resin are preferably used for flexible printed circuit boards, tapes for TAB (Tape Automated Bonding), composite lead frames, and lamination materials, or the like, and an adhesive laminate film suitable for coating of a superconductive wire rod.

公开(公告)号：EP1568471A4

公开(公告)日：2009-08-19

申请号：EP03758957

申请日：2003-10-27

申请人： KANEKA CORP

发明人： HASE NAOKI ,  MATSUKUBO SHINJI ,  TSUJI HIROYUKI ,  FUSHIKI YASUO

IPC分类号： B29C65/44 ,  B32B37/06 ,  B32B37/08 ,  H05K3/02

CPC分类号： B32B37/0015 ,  B29C66/7422 ,  B29C66/74283 ,  B32B37/06 ,  B32B37/08 ,  B32B2311/00 ,  B32B2379/08 ,  B32B2398/00 ,  H05K3/022

摘要： A method for manufacturing a laminated board by continuously bonding a metal foil to a heat-resistant film having a fusion bondability, characterized in that the periphery of the laminated board is cooled to a temperature equal to or higher than that of the central part of the laminated board in the cooling process after the bonding. This method prevents the problem that the laminated board cannot be fixed at a circuit pattern forming step because of the waviness of the peripheral part of the laminated board, thus providing a laminated board with favorable appearance.

公开(公告)号：EP1260538A4

公开(公告)日：2003-01-02

申请号：EP00964744

申请日：2000-10-06

申请人： KANEKA CORP

发明人： KIKUCHI TAKESHI ,  TSUJI HIROYUKI ,  OKADA KOJI ,  FURUTANI HIROYUKI ,  TANAKA KOICHIRO ,  HARA SHOJI ,  NOJIRI HITOSHI

IPC分类号： C08G73/10

CPC分类号： C08G73/10 ,  C08G73/1035

摘要： A process for producing a high-molecular polyimide resin in high yield with ease, which comprises heating and drying a mixture of monomers for the polyimide at a reduced pressure.

公开(公告)号：EP1566263A4

公开(公告)日：2010-05-05

申请号：EP03769893

申请日：2003-10-09

申请人： KANEKA CORP

发明人： KIKUCHI TAKASHI ,  HASE NAOKI ,  TSUJI HIROYUKI ,  FUSHIKI YASUO

IPC分类号： B32B15/08 ,  B29C65/02 ,  B29L9/00 ,  B32B37/00 ,  B32B37/26 ,  H05K1/00 ,  H05K3/02 ,  H05K3/38

CPC分类号： B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B37/0007 ,  B32B37/26 ,  B32B2307/306 ,  B32B2307/734 ,  B32B2309/105 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/068 ,  Y10T156/10 ,  Y10T428/31678 ,  Y10T428/31721

公开(公告)号：EP1281727A4

公开(公告)日：2004-08-04

申请号：EP00974953

申请日：2000-11-10

申请人： KANEKA CORP

发明人： TSUJI HIROYUKI ,  KIKUCHI TAKESHI ,  TANAKA KOICHIRO ,  FURUTANI HIROYUKI

IPC分类号： C08G73/10 ,  C09J7/00 ,  C09J7/02 ,  H05K1/03

CPC分类号： C08G73/105 ,  C08G73/10 ,  C08G73/101 ,  C08G73/1032 ,  C08G73/1039 ,  C08G73/1053 ,  C08G73/1064 ,  C09J7/10 ,  C09J7/22 ,  C09J7/25 ,  C09J7/35 ,  C09J2463/00 ,  C09J2479/08 ,  C09J2479/086 ,  H05K1/0346

摘要： An object of the present invention relates to a soluble polyimide having an excellent heat resistance and low water absorption, a composition containing the soluble polyimide, which is cured at a relatively low temperature and has excellent heat resistance and adhesive properties, a bonding sheet using the composition, and adhesive laminated film for covering an accelerator beam tube and for covering a conductor wire for an accelerator quench heater, which have excellent workability, flexibility, and radiation resistance at a low temperature and especially have excellent adhesive properties. The polyimide is obtained by reacting an acid dianhydride represented by the general formula (1) (wherein X represents a bivalent organic group having -(CH2)k- or an aromatic group and k is an integer of 1 to 10) with a compound represented by the general formula (2) (wherein A represents -NH2- or -NCO, Y independently represents -C(=O)-, -SO2-, -O-, -S-, -(CH2)m-, -NHCO-, -C(CH3)2-, -C(CF3)2-, -C(=O)O- or a single bond, and m and n each are an integer of 0 to 10). The polyimide has a solubility of 10% or higher at 20 DEG C even in a low-boiling organic solvent, and has a glass transition temperature of 100 DEG C to 250 DEG C and water absorption of 1.5% or lower. Specially, by mixing with epoxy resin, the soluble polyimide is used as a composition, solution of polyimide adhesive, laminator, bonding sheet, and adhesive laminated films suitable for covering an accelerator beam tube or for covering a conductor wire for an accelerator quench heater.