公开(公告)号：EP1566263A4

公开(公告)日：2010-05-05

申请号：EP03769893

申请日：2003-10-09

申请人： KANEKA CORP

发明人： KIKUCHI TAKASHI ,  HASE NAOKI ,  TSUJI HIROYUKI ,  FUSHIKI YASUO

IPC分类号： B32B15/08 ,  B29C65/02 ,  B29L9/00 ,  B32B37/00 ,  B32B37/26 ,  H05K1/00 ,  H05K3/02 ,  H05K3/38

CPC分类号： B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B37/0007 ,  B32B37/26 ,  B32B2307/306 ,  B32B2307/734 ,  B32B2309/105 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/068 ,  Y10T156/10 ,  Y10T428/31678 ,  Y10T428/31721

公开(公告)号：EP1568471A4

公开(公告)日：2009-08-19

申请号：EP03758957

申请日：2003-10-27

申请人： KANEKA CORP

发明人： HASE NAOKI ,  MATSUKUBO SHINJI ,  TSUJI HIROYUKI ,  FUSHIKI YASUO

IPC分类号： B29C65/44 ,  B32B37/06 ,  B32B37/08 ,  H05K3/02

CPC分类号： B32B37/0015 ,  B29C66/7422 ,  B29C66/74283 ,  B32B37/06 ,  B32B37/08 ,  B32B2311/00 ,  B32B2379/08 ,  B32B2398/00 ,  H05K3/022

摘要： A method for manufacturing a laminated board by continuously bonding a metal foil to a heat-resistant film having a fusion bondability, characterized in that the periphery of the laminated board is cooled to a temperature equal to or higher than that of the central part of the laminated board in the cooling process after the bonding. This method prevents the problem that the laminated board cannot be fixed at a circuit pattern forming step because of the waviness of the peripheral part of the laminated board, thus providing a laminated board with favorable appearance.