发明公开
- 专利标题: SYSTEM AND METHOD FOR CUTTING USING A VARIABLE ASTIGMATIC FOCAL BEAM SPOT
- 专利标题(中): 方法切割使用聚焦射线点变散光
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申请号: EP04712846.7申请日: 2004-02-19
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公开(公告)号: EP1595250A2公开(公告)日: 2005-11-16
- 发明人: SERCEL, Patrick, J. , SERCEL, Jeffrey, P. , PARK, Jongkook
- 申请人: JP Sercel Associates Inc.
- 申请人地址: 17D Clinton Drive Hollis, NH 03049 US
- 专利权人: JP Sercel Associates Inc.
- 当前专利权人: JP Sercel Associates Inc.
- 当前专利权人地址: 17D Clinton Drive Hollis, NH 03049 US
- 代理机构: McLean, Robert Andreas
- 优先权: US448503P 20030219
- 国际公布: WO2004075174 20040902
- 主分类号: G11B3/00
- IPC分类号: G11B3/00
摘要:
A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.
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