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公开(公告)号：EP1735837B1
公开(公告)日：2012-05-09
申请号：EP05731585.5
申请日：2005-03-29
CPC分类号： H01L21/268 , B23K26/0057 , B23K26/0063 , B23K26/0732 , B23K26/0838 , B23K26/40 , B23K2201/40 , B23K2203/172 , H01L21/78 , H01L21/7806 , H01L33/0079 , H01L2221/68363 , H01L2924/0002 , H01L2924/00
摘要： A lift off process is used to separate a layer of material from a substrate (110) by irradiating an interface between the layer of material and the substrate (110). According to one exemplary process, the layer is separated into a plurality of sections (112) corresponding to dies on the substrate (110) and a homogeneous beam spot is shaped to cover an integer number of the sections (112).
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公开(公告)号：EP1595250B1
公开(公告)日：2012-04-11
申请号：EP04712846.7
申请日：2004-02-19
IPC分类号： G11B3/00
CPC分类号： G03F7/70383 , B23K26/0608 , B23K26/0613 , B23K26/0617 , B23K26/0624 , B23K26/066 , B23K26/067 , B23K26/0736 , B23K26/364 , B23K26/40 , B23K2201/40 , B23K2203/12 , B23K2203/50
摘要： A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.
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公开(公告)号：EP1595250A2
公开(公告)日：2005-11-16
申请号：EP04712846.7
申请日：2004-02-19
IPC分类号： G11B3/00
CPC分类号： G03F7/70383 , B23K26/0608 , B23K26/0613 , B23K26/0617 , B23K26/0624 , B23K26/066 , B23K26/067 , B23K26/0736 , B23K26/364 , B23K26/40 , B23K2201/40 , B23K2203/12 , B23K2203/50
摘要： A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.
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公开(公告)号：EP1735837A2
公开(公告)日：2006-12-27
申请号：EP05731585.5
申请日：2005-03-29
CPC分类号： H01L21/268 , B23K26/0057 , B23K26/0063 , B23K26/0732 , B23K26/0838 , B23K26/40 , B23K2201/40 , B23K2203/172 , H01L21/78 , H01L21/7806 , H01L33/0079 , H01L2221/68363 , H01L2924/0002 , H01L2924/00
摘要： A lift off process is used to separate a layer of material from a substrate (110) by irradiating an interface between the layer of material and the substrate (110). According to one exemplary process, the layer is separated into a plurality of sections (112) corresponding to dies on the substrate (110) and a homogeneous beam spot is shaped to cover an integer number of the sections (112).
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