发明公开
- 专利标题： PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE
- 专利标题（中）： 方法耐热浮雕结构
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申请号： EP03799889.5申请日： 2003-12-11
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公开(公告)号： EP1609026A2公开(公告)日： 2005-12-28
- 发明人: NAIINI, Ahmad, A. , RUSHKIN, Ii'ya , HOPLA, Richard , WATERSON, Pamela, J. , WEBER, William, D.
- 申请人： FujiFilm Electronic Materials USA, Inc.
- 申请人地址： 80 Circuit Drive North Kingstown, RI 02852 US
- 专利权人： FujiFilm Electronic Materials USA, Inc.
- 当前专利权人： FujiFilm Electronic Materials USA, Inc.
- 当前专利权人地址： 80 Circuit Drive North Kingstown, RI 02852 US
- 代理机构： Campbell, Neil Boyd
- 优先权： US432794P 20021212
- 国际公布： WO2004055593 20040701
- 主分类号： G03F7/095
- IPC分类号： G03F7/095 ; G03F7/30 ; G03F7/38 ; G03F7/40 ; G03F7/037
摘要：
A process for producing a heat resistant relief structure on a substrate, the process comprising the steps of: (a) providing a substrate; (b) in a first coating step, coating the substrate with a composition comprising a polyamic acid and gamma-butyrolactone to form a layer of polyamic acid having a thickness of at least about 0.5 umicro;m; (c) baking the layer of polyamic acid at a temperature or temperatures below 140 °C; (d) in a second coating step, coating a layer of a photoresist over the layer of polyamic acid to form a bilayer coating; (e) exposing the bilayer coating to radiation
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