NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
    6.
    发明公开
    NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS 审中-公开
    新型光敏树脂组合

    公开(公告)号:EP1886187A2

    公开(公告)日:2008-02-13

    申请号:EP06771936.9

    申请日:2006-06-02

    IPC分类号: G03C1/00

    摘要: A photosensitive resin composition comprising: (d) at least one polybenzoxazole precursor polymer (e) at least one compound having structure VI : V1-Y-V2, wherein Y is selected from S, O, NR2, (HOCH)P , and Formula (A) each R1 is selected H, an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group or a halogen, each R2 is selected from H, SH, CH3, C2H5, and a linear or branched C1-C4 alkyl group containing a thiol group; p is an integer of from 1 to 4, and wherein V1 and V2 are independently selected from the group consisting of Formula (B) and Formula (C) wherein, m is independently an integer from 0 to 4 with the proviso that m = 0 only when Y = Formula (D) n is an integer from 1 to 5; and each R1 is defined as above; and (f) at least one solvent; wherein the amount of the compound of Structure VI present is an amount effective to inhibit residue from forming when the composition is coated on a substrate and the substrate is subsequently processed to form an image, and with the proviso that if the polybenzoxazole precursor polymer solely consists of polybenzoxazole precursor polymers that do not contain a photoactive moiety on the polymer, then (d) at least one photoactive compound is also present in the composition.

    PRETREATMENT COMPOSITIONS
    7.
    发明公开
    PRETREATMENT COMPOSITIONS 审中-公开
    成分用于治疗

    公开(公告)号:EP1861750A2

    公开(公告)日:2007-12-05

    申请号:EP06748492.3

    申请日:2006-03-22

    IPC分类号: G03C5/00

    摘要: A pretreatment composition for treating a substrate to be subjected to forming a relief pattern thereon by exposure to actinic radiation, the pretreatment composition comprising: (a) at least one compound having Structure (VI), wherein, V is selected from CH and N, Y is selected from O and NR3 wherein R3 is selected from H, CH3 and C2H5, R1 and R2 are each independently selected from H, a C1 - C4 alkyl group, a C1 - C4 alkoxy group, cyclopentyl and cyclohexyl, or alternatively, R1 and R2 can be fused to produce a substituted or unsubstituted benzene ring, with the proviso that the substituent is not an electron withdrawing group, (b) at least one organic solvent, and optionally, (c) at least one adhesion promoter; wherein the amount of the compound of Structure (VI) present in the composition effective to inhibit residue from forming when the photosensitive composition is coated on a substrate and the coated substrate is subsequently processed to form an image on the substrate. Processes for pretreatment of substrates and processes for forming relief images on pretreated substrates are disclosed.

    NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
    8.
    发明公开
    NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS 审中-公开
    NEW感光性树脂组合物

    公开(公告)号:EP1861749A2

    公开(公告)日:2007-12-05

    申请号:EP06739266.2

    申请日:2006-03-22

    IPC分类号: G03C1/00

    摘要: A photosensitive resin composition comprising: (a) at least one polybenzoxazole precursor polymer; (b) at least one compound having Structure Vl wherein, V is CH or N, Y is O or NR3 wherein R3 is H, CH3 or C2H5, R1 and R2 each independently are H, C1 - C4 alkyl group, C1 - C4 alkoxy group, cyclopentyl or cyclohexyl, or alternatively, R1 and R2 can be fused to produce a substituted or unsubstituted benzene ring; and (c) at least one solvent; wherein the amount of the compound of Structure VI present in the composition is effective to inhibit residue from forming when the composition is coated on a substrate and the coated substrate is subsequently processed to form an image on the substrate, and with the proviso that if the polybenzoxazole precursor polymer solely consists of polybenzoxazole precursor polymers that do not contain a photoactive moiety in the polymer, then (d) at least one photoactive compound is also present in the composition.. The present invention also concerns a process for forming a relief pattern and electronic parts using the composition.

    NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
    9.
    发明公开
    NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS 审中-公开
    新型光敏树脂组合物

    公开(公告)号:EP1606326A2

    公开(公告)日:2005-12-21

    申请号:EP04718820.6

    申请日:2004-03-09

    IPC分类号: C08F36/00

    摘要: New photosensitive PBO precursor polymers which contain diazoquinone moieties attached to its backbone and in which all amino end groups are converted into amide groups. The photosensitive formulation based on the disclosed PBO precursor polymers have good imaging and mechanical properties as well as superior shelf life stability. Photosensitive polybenzoxazole precursor polymers having (sulfon)amide end groups (with or without attached diazoquinone groups) can be formulated into photosensitive compositions with diazoquinone photoactive compounds which lack benzylic hydrogens on the backbone to yield compositions producing films significantly lighter in color after curing.

    摘要翻译: 新的光敏PBO前体聚合物含有连接在其骨架上的重氮醌部分,并且其中所有的氨基端基都转化为酰胺基团。 基于公开的PBO前体聚合物的光敏制剂具有良好的成像和机械性能以及优越的储存期限稳定性。 具有(磺酰)酰胺端基(具有或不具有连接的重氮醌基团)的光敏聚苯并恶唑前体聚合物可以配制成具有在主链上缺少苄基氢的重氮醌光活性化合物的光敏组合物,以产生在固化后产生颜色明显较浅的膜的组合物。