发明公开
- 专利标题: Vibration type MEMS switch and fabricating method thereof
- 专利标题(中): 振动型和制造工艺的一种微机电开关
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申请号: EP05014807.1申请日: 2005-07-07
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公开(公告)号: EP1619710A3公开(公告)日: 2006-09-20
- 发明人: Lee, Moon-chul , Park, Tae-sik , Jeong, Hee-moon
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: 416 Maetan dong, Paldal-gu Suwon-si, Gyeonggi-do KR
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: 416 Maetan dong, Paldal-gu Suwon-si, Gyeonggi-do KR
- 代理机构: Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
- 优先权: KR2004056579 20040720
- 主分类号: H01H59/00
- IPC分类号: H01H59/00
摘要:
A vibration type MEMS switch and a method of fabricating the vibration type MEMS switch. The vibration type MEMS switch includes a vibrating body supplied with an alternating current voltage of a predetermined frequency to vibrate in a predetermined direction; and a stationary contact point spaced apart from the vibrating body along a vibration direction of the vibrating body. When a direct current voltage with a predetermined magnitude is applied to the stationary contact point, a vibration margin of the vibrating body is increased, the vibrating body contacts the stationary contact point and the vibration type MEMS switch is turned on. A first substrate is bonded to a second substrate to isolate the vibrating body in a sealed vacuum space. The vibration type MEMS switch is turned on and/off by a resonance.
公开/授权文献
- EP1619710B1 Vibration type MEMS switch and fabricating method thereof 公开/授权日:2012-03-21
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