In a ceramic circuit board 1 prepared by integrally joining a circuit layer 4 composed of a clad member including a circuit plate 2 made of an Al plate and an Al-Si brazing material layer 3 to a ceramic substrate 6, a surface of the clad member adjacent to the Al-Si brazing material layer 3 is joined to the ceramic substrate 6 with an Al alloy film 5 therebetween, the Al alloy film 5 having a thickness of less than 1 µm and being provided on the surface of the ceramic substrate 6. According to this structure, a ceramic circuit board in which the generation of voids in the joint interface can be effectively suppressed, the joint strength of the metal member serving as the circuit layer can be increased, and the heat resistance cycle characteristics can be drastically improved, and a method for producing the same can be provided.