发明公开
EP1674396A1 PACKAGING DEVICE AND PACKAGING METHOD FOR HOLLOW CATHODE TYPE SPATTERING TARGET
审中-公开
VERPACKUNGSVORRICHTUNG UND VERPACKUNGSVERFAHRENFÜRHOHLKATHODEN-SPUTTERTARGET
- 专利标题： PACKAGING DEVICE AND PACKAGING METHOD FOR HOLLOW CATHODE TYPE SPATTERING TARGET
- 专利标题（中）： VERPACKUNGSVORRICHTUNG UND VERPACKUNGSVERFAHRENFÜRHOHLKATHODEN-SPUTTERTARGET
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申请号： EP04773025.4申请日： 2004-09-14
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公开(公告)号： EP1674396A1公开(公告)日： 2006-06-28
- 发明人: OKABE, T. Isohara Factory, Nikko Materials Co. Ltd , NAGASAWA, M. Isohara Fact. Nikko Materials Co. Ltd
- 申请人： Nikko Materials Company, Limited
- 申请人地址： 10-1, Toranomon 2-chome, Minato-ku Tokyo 105-0001 JP
- 专利权人： Nikko Materials Company, Limited
- 当前专利权人： Nikko Materials Company, Limited
- 当前专利权人地址： 10-1, Toranomon 2-chome, Minato-ku Tokyo 105-0001 JP
- 代理机构： Hoarton, Lloyd Douglas Charles
- 优先权： JP2003354456 20031015
- 国际公布： WO2005037649 20050428
- 主分类号： B65B31/04
- IPC分类号： B65B31/04 ; C23C14/34
摘要：
Provided are a packaging device and packaging method of a hollow cathode sputtering target which installs, in the hollow cathode sputtering target, a cover of a size capable of covering a void of the target; provides one or more through-holes to the cover; places a resin bag over them, and performs vacuum suction to the inside of the bag. This packaging device and packaging method of a hollow cathode sputtering target is capable of performing vacuum suction even to the inside of the hollow portion covered with the resin bag.
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