公开(公告)号：EP1674396A1

公开(公告)日：2006-06-28

申请号：EP04773025.4

申请日：2004-09-14

申请人： Nikko Materials Company, Limited

发明人： OKABE, T. Isohara Factory, Nikko Materials Co. Ltd ,  NAGASAWA, M. Isohara Fact. Nikko Materials Co. Ltd

IPC分类号： B65B31/04 ,  C23C14/34

CPC分类号： H01J37/342 ,  B65B31/04 ,  B65D81/2023

摘要： Provided are a packaging device and packaging method of a hollow cathode sputtering target which installs, in the hollow cathode sputtering target, a cover of a size capable of covering a void of the target; provides one or more through-holes to the cover; places a resin bag over them, and performs vacuum suction to the inside of the bag. This packaging device and packaging method of a hollow cathode sputtering target is capable of performing vacuum suction even to the inside of the hollow portion covered with the resin bag.

摘要翻译： 提供一种中空阴极溅射靶的包装装置和封装方法，该空心阴极溅射靶在空心阴极溅射靶中安装能够覆盖靶的空隙的尺寸的盖; 向盖子提供一个或多个通孔; 在其上放置树脂袋，并对袋子的内部进行真空抽吸。 这种包装装置和空心阴极溅射靶的包装方法即使在覆盖有树脂袋的中空部分的内部也能够进行真空吸附。