发明公开
- 专利标题： METHOD FOR GLUING A CIRCUIT COMPONENT TO A CIRCUIT SUBSTRATE
- 专利标题（中）： 方法用于连接的电路元件的电路基板
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申请号： EP04791280.3申请日： 2004-10-21
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公开(公告)号： EP1676307A2公开(公告)日： 2006-07-05
- 发明人: KONRATH, Willibald , SCHMELCHER, Haiko , SCHOLL, Klaus , MULLER, Ulf
- 申请人： Marconi Communications GmbH
- 申请人地址： Gerberstrasse 33 71520 Backnang DE
- 专利权人： Marconi Communications GmbH
- 当前专利权人： Marconi Communications GmbH
- 当前专利权人地址： Gerberstrasse 33 71520 Backnang DE
- 代理机构： Collier, Ian Terry
- 优先权： DE10349167 20031022
- 国际公布： WO2005041289 20050506
- 主分类号： H01L21/58
- IPC分类号： H01L21/58 ; H05K13/04
摘要：
A circuit component (1) is glued to the circuit substrate (2) by the following steps:, a) seizing a circuit component (1) using a grip-per (4); b) moving the gripper (4) towards the surface of the circuit substrate (2) up to a target distance from the surface at which adhesive (3) applied between the circuit component (1) and the circuit substrate (2) is pressed; C) releasing the circuit component (1) and removing the gripper (4) from the circuit component (1); d) turning the gripper (4) around an axis (A) perpendicular to the surface of the circuit substrate (2); e) moving the gripper (4) into the target distance again; and f) removing the gripper (4) again.
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