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公开(公告)号：EP1629706A1
公开(公告)日：2006-03-01
申请号：EP04766034.5
申请日：2004-06-04
发明人： MULLER, Ulf , KONRATH, Willibald , SCHOLL, Klaus , SCHMELCHER, Haiko , GORTZEN, Ralf , NAHRING, Martin
CPC分类号： H05K13/0015 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49133
摘要： In a procedure for automatically placing components (20 to 23) of a circuit on a base plate (6) based on predefined position data, a) the position of at least one first reference mark (24) formed at the base plate (6) is detected; b) a target position for placing a substrate (20) on the base plate (6) is calculated based on the detected position of the first reference mark (24) and the position data, and the substrate (20) is placed at the calculated position; C) the position of at least one second reference mark (26) formed at the substrate (20) is detected and d) a target position for placing a further component (21, 22) on the substrate (20) is calculated based on the detected position of the second reference mark (26) and the position data predefined for said component (21, 22), and the component (21, 22) is placed at the calculated target position.
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公开(公告)号：EP1676307A2
公开(公告)日：2006-07-05
申请号：EP04791280.3
申请日：2004-10-21
CPC分类号： H01L24/83 , H01L21/67132 , H01L24/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , H01L2924/1423 , H05K13/0465 , Y10T29/4913 , Y10T29/49133 , Y10T29/53191 , H01L2924/00
摘要： A circuit component (1) is glued to the circuit substrate (2) by the following steps:, a) seizing a circuit component (1) using a grip-per (4); b) moving the gripper (4) towards the surface of the circuit substrate (2) up to a target distance from the surface at which adhesive (3) applied between the circuit component (1) and the circuit substrate (2) is pressed; C) releasing the circuit component (1) and removing the gripper (4) from the circuit component (1); d) turning the gripper (4) around an axis (A) perpendicular to the surface of the circuit substrate (2); e) moving the gripper (4) into the target distance again; and f) removing the gripper (4) again.
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3.发明授权AUTOMATED CIRCUIT BOARD ASSEMBLY SYSTEM COMPRISING A CIRCUIT BOARD ALIGNEMENT DEVICE 有权包括电路板对齐装置的自动电路板组装系统
公开(公告)号：EP1472920B1
公开(公告)日：2005-06-29
申请号：EP03706775.8
申请日：2003-01-28
IPC分类号： H05K13/00
CPC分类号： H05K13/0061
摘要： An automated circuit board assembly system with at least one moveable circuit board receiver that is equipped with an empty circuit board or hybrid circuit which is transported towards an uptake location at which components are assembled to the board, and with an uptake mechanism positioned at the uptake location which detects the circuit board position in preparation for the assembly process. An alignment device positions the circuit board receiver in a predetermined directional position at the uptake location. The invention further concerns corresponding processes.
摘要翻译： 一种具有至少一个可移动电路板接收器的自动化电路板组装系统，该接收器配备有空的电路板或混合电路，该电路板或混合电路被朝着将组件组装到电路板的上取位置传送，并且具有位于上摄取位置的上摄取机构 在准备装配过程中检测电路板位置的位置。 对准装置将电路板接收器定位在上摄位置处的预定方向位置。 本发明还涉及相应的过程。
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公开(公告)号：EP1472920A1
公开(公告)日：2004-11-03
申请号：EP03706775.8
申请日：2003-01-28
IPC分类号： H05K13/00
CPC分类号： H05K13/0061
摘要： An automated circuit board assembly system with at least one moveable circuit board receiver that is equipped with an empty circuit board or hybrid circuit which is transported towards an uptake location at which components are assembled to the board, and with an uptake mechanism positioned at the uptake location which detects the circuit board position in preparation for the assembly process. An alignment device positions the circuit board receiver in a predetermined directional position at the uptake location. The invention further concerns corresponding processes.
摘要翻译： 一种具有至少一个可移动电路板接收器的自动化电路板组装系统，该接收器配备有空的电路板或混合电路，该电路板或混合电路被朝着将组件组装到电路板的上取位置传送，并且具有位于上摄取位置的上摄取机构 在准备装配过程中检测电路板位置的位置。 对准装置将电路板接收器定位在上摄位置处的预定方向位置。 本发明还涉及相应的过程。
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公开(公告)号：EP1621058A1
公开(公告)日：2006-02-01
申请号：EP04730548.7
申请日：2004-04-30
发明人： KONRATH, Willibald , SCHOLL, Klaus , SCHMELCHER, Haiko , GORTZEN, Ralf , NAHRING, Martin , MULLER, Ulf
IPC分类号： H05K13/04
CPC分类号： H05K13/0469 , H05K3/305 , H05K2203/0126 , H05K2203/0545 , Y02P70/613 , Y10T156/1089
摘要： For gluing a circuit component (51) onto a circuit board (6), the circuit component (51) having a bottom area for bringing into contact with the circuit board with at least one edge (52, 53), the distance (d]) between the edge and a first line (56, 57) parallel to said edge and an amount of adhesive to be applied per length unit along said line (56, 57) are determined such that when placing the circuit component (51) on the circuit board (6) the adhesive advances to said edge (52, 53) but not to a second circuit component (54, 55) adjacent to said edge; the adhesive is applied ill the selected quantity along said first line (56, 57) and along further lilies (58) which are parallel to said first line and further away from said edge (52, 53); then the circuit component (51) is placed on the circuit board (6).
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公开(公告)号：EP1704761A1
公开(公告)日：2006-09-27
申请号：EP05707759.6
申请日：2005-01-10
IPC分类号： H05K13/04
CPC分类号： H05K3/321 , H05K13/0469 , H05K2203/0126 , H05K2203/0522
摘要： For gluing a circuit component (17) to a circuit board (1), at first at least one fore-running adhesive dot (14) is placed within a contact area (2) between the circuit component (17) and the circuit board (1), then adhesive dots (4) are placed in a regular pattern, and finally the adhesive dots (4) are brought to merge by pressing the circuit component (17) and the circuit board (1) against each other.
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