发明公开
- 专利标题： Solid-state imaging device and method of manufacturing the same
- 专利标题（中）： 固态成像装置及其制造方法
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申请号： EP06008630.3申请日： 2003-07-14
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公开(公告)号： EP1686617A3公开(公告)日： 2007-01-03
- 发明人: Maeda, Hiroshi , Nishida, Kazuhiro , Negishi, Yoshihisa , Hosaka, Shunichi
- 申请人： Fuji Photo Film Co., Ltd.
- 申请人地址： 210 Nakanuma Minami-Ashigara-shi, Kanagawa JP
- 专利权人： Fuji Photo Film Co., Ltd.
- 当前专利权人： Fuji Photo Film Co., Ltd.
- 当前专利权人地址： 210 Nakanuma Minami-Ashigara-shi, Kanagawa JP
- 代理机构： Stevens, Jason Paul
- 优先权： JP2002219645 20020729; JP2002219791 20020729
- 主分类号： H01L21/339
- IPC分类号： H01L21/339 ; H01L27/146 ; H01L27/148 ; H01L31/0203 ; H01L31/0232
摘要：
The invention provides a solid-state imaging device comprising a first semiconductor substrate provided with an IT-CCD, and a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD. A second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate.
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