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公开(公告)号：EP1686617A3
公开(公告)日：2007-01-03
申请号：EP06008630.3
申请日：2003-07-14
IPC分类号： H01L21/339 , H01L27/146 , H01L27/148 , H01L31/0203 , H01L31/0232
CPC分类号： H01L27/14627 , H01L27/14618 , H01L27/14632 , H01L27/14634 , H01L27/14683 , H01L27/14685 , H01L27/14687 , H01L27/14843 , H01L29/66954 , H01L2224/16 , H01L2924/16235
摘要： The invention provides a solid-state imaging device comprising a first semiconductor substrate provided with an IT-CCD, and a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD. A second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate.
摘要翻译： 本发明提供一种固态成像装置，包括：设置有IT-CCD的第一半导体基板，以及连接到第一半导体基板以便具有与IT-CCD的光接收区域相对的间隙的半透明构件。 其上形成有外围电路的第二半导体衬底设置在与要形成IT-CCD的第一半导体衬底的表面相对的表面上，并且外围电路经由通孔连接到IT-CCD 提供在第一半导体衬底上。
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2.发明公开
公开(公告)号：EP1329765A3
公开(公告)日：2004-08-18
申请号：EP03001060.7
申请日：2003-01-17
发明人： Nagasawa, Hideharu , Ichikawa, Yasunori , Shiraishi, Fumiko , Maeda, Hiroshi , Fujisawa, Mamoru
CPC分类号： B01F13/0062 , B01F5/0453 , B01F5/046 , B01F11/0266 , B01F13/0001 , B01F13/0066 , B01F13/0067 , B01F15/067 , B01F2215/0454 , B01J19/0093 , B01J2219/00783 , B01J2219/00822 , B01J2219/00833 , B01J2219/00869 , B01J2219/00873 , B01J2219/00889 , G03C1/015 , G03C1/08 , G03C2200/09 , G03C2200/58
摘要： At least one of a nucleus forming process, a nucleus growing process, a chemical sensitizing process, and a spectral sensitizing process for producing a silver halide photographic emulsion is performed by using a microreactor. A minute region of the microreactor is used to precisely perform a reaction of nucleus formation. A condition under which host grains are allowed to react with newly supplied silver halide nuclei is made uniform to cause uniform crystal growth. A predetermined quantity of molecules for chemical sensitization is doped in a crystal lattice of a nucleus of silver halide to effect a sensitizing process. Alternatively, a spectral sensitizing process in which a single molecular layer of a spectral sensitizer is uniformly adsorbed on a silver halide nucleus grain surface is securely carried out.
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3.发明公开Method for the production of silver halide photographic emulsions and production apparatus therefor 审中-公开Verfahren und Vorrichtung zur Herstellung photographischer Silberhalogenidemulsionen
公开(公告)号：EP1329765A2
公开(公告)日：2003-07-23
申请号：EP03001060.7
申请日：2003-01-17
发明人： Nagasawa, Hideharu , Ichikawa, Yasunori , Shiraishi, Fumiko , Maeda, Hiroshi , Fujisawa, Mamoru
CPC分类号： B01F13/0062 , B01F5/0453 , B01F5/046 , B01F11/0266 , B01F13/0001 , B01F13/0066 , B01F13/0067 , B01F15/067 , B01F2215/0454 , B01J19/0093 , B01J2219/00783 , B01J2219/00822 , B01J2219/00833 , B01J2219/00869 , B01J2219/00873 , B01J2219/00889 , G03C1/015 , G03C1/08 , G03C2200/09 , G03C2200/58
摘要： At least one of a nucleus forming process, a nucleus growing process, a chemical sensitizing process, and a spectral sensitizing process for producing a silver halide photographic emulsion is performed by using a microreactor. A minute region of the microreactor is used to precisely perform a reaction of nucleus formation. A condition under which host grains are allowed to react with newly supplied silver halide nuclei is made uniform to cause uniform crystal growth. A predetermined quantity of molecules for chemical sensitization is doped in a crystal lattice of a nucleus of silver halide to effect a sensitizing process. Alternatively, a spectral sensitizing process in which a single molecular layer of a spectral sensitizer is uniformly adsorbed on a silver halide nucleus grain surface is securely carried out.
摘要翻译： 通过使用微反应器进行核生成过程，核生长过程，化学增感过程和用于生产卤化银照相乳剂的光谱增感方法中的至少一种。 微反应器的微小区域用于精确地进行核形成反应。 使主体颗粒与新提供的卤化银核反应的条件被均匀化以引起均匀的晶体生长。 预定量的用于化学增感的分子被掺杂在卤化银核的晶格中以实现敏化过程。 或者，可靠地进行光谱增感剂的单分子层均匀地吸附在卤化银核粒子表面上的光谱增感方法。
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公开(公告)号：EP1003212A2
公开(公告)日：2000-05-24
申请号：EP99308961.4
申请日：1999-11-10
CPC分类号： H01L21/67144 , H01L21/681 , H01L24/75 , H01L2924/12036 , H01L2924/12042 , H05K1/0269 , H05K3/303 , H05K3/328 , H05K2201/10106 , H05K2203/107 , H05K2203/166 , Y02P70/613 , H01L2924/00
摘要： A bonding apparatus has a probe (16) for causing an LED chip (14) to emit light before the LED chip (14) is bonded on a board (12), an imaging system (18) for recognizing the center of a light-emitting area of the LED chip (14) and recognizing coordinates of a contour reference point of the LED chip (14) with respect to the recognized center of the light-emitting area, and a light-emitting-element holding mechanism (20) for positioning the LED chip (14) in a bonding position on the board (12) based on the recognized coordinates of the contour reference point. The center of the light-emitting area of the LED chip (14) can be positioned highly accurately in a desired position on the board (12) without being adversely affected by variations in the contour dimensions of the LED chip (14).
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公开(公告)号：EP1376705A3
公开(公告)日：2007-01-17
申请号：EP03253964.5
申请日：2003-06-24
IPC分类号： H01L31/0203 , H01L31/02
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2924/0002 , H01L2924/00
摘要： There are provided a semiconductor substrate 101 on which solid-state imaging devices are formed, and a translucent member 201 provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate 101 to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate 101.
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公开(公告)号：EP1686619A3
公开(公告)日：2007-01-03
申请号：EP06008632.9
申请日：2003-07-14
IPC分类号： H01L21/339 , H01L27/146 , H01L27/148 , H01L31/0203 , H01L31/0232
CPC分类号： H01L27/14627 , H01L27/14618 , H01L27/14632 , H01L27/14634 , H01L27/14683 , H01L27/14685 , H01L27/14687 , H01L27/14843 , H01L29/66954 , H01L2224/16 , H01L2924/16235
摘要： The invention provides a solid-state imaging device comprising a semiconductor substrate provided with an IT-CCD and a translucent member connected to the semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD. A connecting terminal is provided on a surface of the translucent member which is opposed to an attached surface of the semiconductor substrate, and the connecting terminal is electrically connected to the semiconductor substrate via a through hole provided in the translucent member.
摘要翻译： 本发明提供一种固态成像装置，其包括设置有IT-CCD的半导体基板和连接至半导体基板的半透明构件，以具有与IT-CCD的光接收区域相对的间隙。 连接端子设置在半透明构件的与半导体基板的附接表面相对的表面上，并且连接端子经由设置在透光构件中的通孔电连接到半导体基板。
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7.发明公开Solid-state imaging device and method of manufacturing the same 审中-公开Festkörper-Bildaufnehmer und Herstellungsverfahrendafür
公开(公告)号：EP1686619A2
公开(公告)日：2006-08-02
申请号：EP06008632.9
申请日：2003-07-14
IPC分类号： H01L21/339 , H01L27/146 , H01L27/148 , H01L31/0203 , H01L31/0232
CPC分类号： H01L27/14627 , H01L27/14618 , H01L27/14632 , H01L27/14634 , H01L27/14683 , H01L27/14685 , H01L27/14687 , H01L27/14843 , H01L29/66954 , H01L2224/16 , H01L2924/16235
摘要： The invention provides a solid-state imaging device comprising a semiconductor substrate provided with an IT-CCD and a translucent member connected to the semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD. A connecting terminal is provided on a surface of the translucent member which is opposed to an attached surface of the semiconductor substrate, and the connecting terminal is electrically connected to the semiconductor substrate via a through hole provided in the translucent member.
摘要翻译： 本发明提供了一种固态成像装置，其包括设置有IT-CCD的半导体衬底和连接到半导体衬底的半透明构件，以便具有与IT-CCD的光接收区域相对的间隙。 连接端子设置在半透明部件的与半导体衬底的附接面相对的表面上，并且连接端子通过设置在透光部件中的通孔与半导体衬底电连接。
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8.发明公开Method of and apparatus for bonding light-emitting element 审中-公开Verfahren und Vorrichtung zum Bonden eines lichtemittierenden Elements
公开(公告)号：EP1003212A3
公开(公告)日：2003-11-19
申请号：EP99308961.4
申请日：1999-11-10
CPC分类号： H01L21/67144 , H01L21/681 , H01L24/75 , H01L2924/12036 , H01L2924/12042 , H05K1/0269 , H05K3/303 , H05K3/328 , H05K2201/10106 , H05K2203/107 , H05K2203/166 , Y02P70/613 , H01L2924/00
摘要： A bonding apparatus has a probe (16) for causing an LED chip (14) to emit light before the LED chip (14) is bonded on a board (12), an imaging system (18) for recognizing the center of a light-emitting area of the LED chip (14) and recognizing coordinates of a contour reference point of the LED chip (14) with respect to the recognized center of the light-emitting area, and a light-emitting-element holding mechanism (20) for positioning the LED chip (14) in a bonding position on the board (12) based on the recognized coordinates of the contour reference point. The center of the light-emitting area of the LED chip (14) can be positioned highly accurately in a desired position on the board (12) without being adversely affected by variations in the contour dimensions of the LED chip (14).
摘要翻译： 接合装置具有用于在将LED芯片（14）接合在基板（12）之前使LED芯片（14）发光的探针（16），用于识别发光二极管的中心的成像系统（18） LED芯片（14）的发光区域和相对于识别出的发光区域的中心识别LED芯片（14）的轮廓基准点的坐标，以及发光元件保持机构（20），用于 基于轮廓参考点的识别坐标将LED芯片（14）定位在板（12）上的接合位置。 LED芯片（14）的发光区域的中心可以高度精确地定位在板（12）上的期望位置，而不受LED芯片（14）的轮廓尺寸的变化的不利影响。
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公开(公告)号：EP0474094B1
公开(公告)日：1995-08-23
申请号：EP91114348.5
申请日：1991-08-27
IPC分类号： B65B25/14
CPC分类号： B65B25/148
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公开(公告)号：EP1387397A3
公开(公告)日：2005-09-07
申请号：EP03254432.2
申请日：2003-07-14
IPC分类号： H01L21/339 , H01L27/146 , H01L27/148 , H01L31/0203 , H01L31/0232
CPC分类号： H01L27/14627 , H01L27/14618 , H01L27/14632 , H01L27/14634 , H01L27/14683 , H01L27/14685 , H01L27/14687 , H01L27/14843 , H01L29/66954 , H01L2224/16 , H01L2924/16235
摘要： It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.
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