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    Photocurable adhesive and bonding process employing same
    2.
    发明公开
    Photocurable adhesive and bonding process employing same 审中-公开
    可光固化的粘合剂和使用它的粘合工艺

    公开(公告)号：EP1518899A3

    公开(公告)日：2005-08-03

    申请号：EP04019993.7

    申请日：2004-08-23

    申请人： Fuji Photo Film Co., Ltd.

    发明人： Hosaka, Shunichi

    IPC分类号： C08L63/00 ,  C08L71/02 ,  C08G65/18 ,  G11B7/26

    CPC分类号： C08G65/18 ,  B32B27/08 ,  C08L71/02 ,  G03F7/038 ,  G11B7/256 ,  G11B7/26

    摘要： An actinic radiation curable adhesive is provided that includes 50 to 99 wt % of a bifunctional and/or a polyfunctional oxetane compound, 0 to 40 wt % of a monofunctional oxetane compound, 1 to 50 wt % of an epoxy compound having a cyclic structure, and a catalytic amount of a photoinitiator. The adhesive has an initial viscosity of 10 to 1,000 mPa·s and a viscosity at gel point of 1 × 10 1 to 9 × 10 6 Pa.s. There is also provided a process for bonding an adherend A and a different adherend B, the process including forming an adhesive layer by coating a surface of the adherend A with the above adhesive at a thickness of 0.05 to 50 µm, irradiating the adhesive layer with actinic radiation, and bonding the adherend B to the adhesive layer after 0.01 to 4 times the time required for gelling of the adhesive layer has passed following the start of irradiation with actinic radiation.

    摘要翻译： 本发明提供一种活性能量射线固化型粘合剂，其含有50〜99重量％双官能和/或多官能氧杂环丁烷化合物，0〜40重量％单官能氧杂环丁烷化合物，1〜50重量％具有环状结构的环氧化合物， 和催化量的光引发剂。 粘合剂的初始粘度为10〜1,000mPa·s，凝胶点的粘度为1×10 9〜10 6 Pa·s。 还提供了一种用于粘合被粘物A和不同的被粘物B的方法，该方法包括通过用0.05至50μm厚度的上述粘合剂涂布被粘物A的表面来形成粘合剂层，用粘合剂层 在光化辐射开始照射之后经过胶粘剂层胶凝所需的时间的0.01至4倍之后，将被粘物B粘合至粘合剂层。

    Photocurable adhesive and bonding process employing same
    3.
    发明公开
    Photocurable adhesive and bonding process employing same 审中-公开
    PhotohärtbareKlebstoffe und Verfestigungsverfahren

    公开(公告)号：EP1518899A2

    公开(公告)日：2005-03-30

    申请号：EP04019993.7

    申请日：2004-08-23

    申请人： Fuji Photo Film Co., Ltd.

    发明人： Hosaka, Shunichi

    IPC分类号： C08L63/00 ,  C08L71/02 ,  C08G65/18 ,  G11B7/26

    CPC分类号： C08G65/18 ,  B32B27/08 ,  C08L71/02 ,  G03F7/038 ,  G11B7/256 ,  G11B7/26

    摘要： An actinic radiation curable adhesive is provided that includes 50 to 99 wt % of a bifunctional and/or a polyfunctional oxetane compound, 0 to 40 wt % of a monofunctional oxetane compound, 1 to 50 wt % of an epoxy compound having a cyclic structure, and a catalytic amount of a photoinitiator. The adhesive has an initial viscosity of 10 to 1,000 mPa·s and a viscosity at gel point of 1 × 10 1 to 9 × 10 6 Pa.s. There is also provided a process for bonding an adherend A and a different adherend B, the process including forming an adhesive layer by coating a surface of the adherend A with the above adhesive at a thickness of 0.05 to 50 µm, irradiating the adhesive layer with actinic radiation, and bonding the adherend B to the adhesive layer after 0.01 to 4 times the time required for gelling of the adhesive layer has passed following the start of irradiation with actinic radiation.

    摘要翻译： 提供了一种光化学辐射固化粘合剂，其包含50至99重量％的双官能和/或多官能氧杂环丁烷化合物，0至40重量％的单官能氧杂环丁烷化合物，1至50重量％的具有环状结构的环氧化合物， 和催化量的光引发剂。 粘合剂的初始粘度为10至1,000mPa.s，凝胶点处的粘度为1×10 9至9×10 6 Pa。 还提供了粘合被粘物A和不同被粘物B的方法，该方法包括通过用上述粘合剂涂覆被粘物A的表面以0.05至50μm的厚度形成粘合剂层，照射粘合剂层 在光化辐射开始照射之后经过粘合剂层凝胶化所需的时间的0.01至4倍之后，将被粘物B粘合到粘合剂层上。

    Solid-state imaging device and method of manufacturing the same
    5.
    发明公开
    Solid-state imaging device and method of manufacturing the same 审中-公开
    Festkörper-Bildaufnahmevorrichtung und Herstellungsverfahren

    公开(公告)号：EP1376705A2

    公开(公告)日：2004-01-02

    申请号：EP03253964.5

    申请日：2003-06-24

    申请人： Fuji Photo Film Co., Ltd.

    发明人： Maeda, Hiroshi ,  Nishida, Kazuhiro ,  Negishi, Yoshihisa ,  Hosaka, Shunichi

    IPC分类号： H01L31/0203 ,  H01L31/02

    CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

    摘要： There are provided a semiconductor substrate 101 on which solid-state imaging devices are formed, and a translucent member 201 provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate 101 to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate 101.

    摘要翻译： 设置有形成固体摄像器件的半导体衬底101和设置在半导体衬底的表面上的半透明构件201，使得设置空间以与固态成像器件的光接收区域相对，其中 外部连接端子被配置在半导体衬底101的相对表面上，与固态成像器件形成表面相连，外部连接端子通过设置在半导体衬底101中的通孔连接到固态成像器件。