发明公开
- 专利标题： POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
- 专利标题（中）： 抛光装置和基板处理装置
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申请号： EP05719731.1申请日： 2005-02-23
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公开(公告)号： EP1719161A1公开(公告)日： 2006-11-08
- 发明人: Hongo, Akihisa , Ito, Kenya , Yamaguchi, Kenji , Nakanishi, Masayuki
- 申请人： EBARA CORPORATION
- 申请人地址： 11-1, Haneda Asahi-cho Ohta-ku, Tokyo 144-8510 JP
- 专利权人： EBARA CORPORATION
- 当前专利权人： EBARA CORPORATION
- 当前专利权人地址： 11-1, Haneda Asahi-cho Ohta-ku, Tokyo 144-8510 JP
- 代理机构： Wagner, Karl H.
- 优先权： JP2004049236 20040225
- 国际公布： WO2005081301 20050901
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B24B9/00
摘要：
The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.
公开/授权文献
- EP1719161B1 POLISHING APPARATUS 公开/授权日：2014-05-07
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