Vaporizer apparatus
    2.
    发明公开
    Vaporizer apparatus 失效
    蒸发器装置

    公开(公告)号:EP0808916A3

    公开(公告)日:1997-12-10

    申请号:EP97108398.5

    申请日:1997-05-23

    申请人: EBARA CORPORATION

    IPC分类号: C23C16/00 B01D1/00

    CPC分类号: B01D1/00 C23C16/4481

    摘要: Heat can be supplied effectively to a porous member of a vaporizer apparatus so that the vaporizing operation can be carried out smoothly and efficiently. The vaporizer apparatus comprises a vaporizer section (B) having a porous member (9) including a liquid receiving surface and a vapor discharge surface; a feed supply section (A) for supplying a liquid feed material to the liquid receiving surface of the porous member; a heating medium passage (P1) in thermal contact with the porous member; and a heating medium supply system for flowing a heating medium (L2) of a temperature higher than a vaporization temperature of the liquid feed material, through the heating medium passage.

    摘要翻译: 可以将热量有效地供给到蒸发装置的多孔部件,从而可以平稳有效地进行蒸发操作。 蒸发器装置包括具有包括液体接收表面和蒸汽排出表面的多孔构件(9)的蒸发器部分(B) 供给供给部分(A),用于将液体供给材料供给到多孔构件的液体接收表面; 与所述多孔构件热接触的加热介质通路(P1) 以及加热介质供应系统,用于使温度高于供液材料的蒸发温度的加热介质(L2)流过加热介质通道。

    POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
    3.
    发明公开
    POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 有权
    抛光装置和基板处理装置

    公开(公告)号:EP1719161A1

    公开(公告)日:2006-11-08

    申请号:EP05719731.1

    申请日:2005-02-23

    申请人: EBARA CORPORATION

    IPC分类号: H01L21/304 B24B9/00

    摘要: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

    摘要翻译: 抛光设备技术领域本发明涉及一种用于去除在基板的周边部分处产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光设备。 该研磨装置具备:在内部形成研磨室的壳体;保持基板并使其旋转的旋转台​​;向研磨室内供给研磨带并卷绕被供给至研磨用研磨带的研磨带的研磨带供给机构 室,用于将研磨带按压在基板的斜面部上的研磨头,用于向基板的表面和背面供给液体的液体供给装置,以及用于使研磨室的内压 被设定为低于抛光室的外部压力。

    Reactant gas injector for chemical vapor deposition apparatus
    5.
    发明公开
    Reactant gas injector for chemical vapor deposition apparatus 失效
    ReaktivgasinjektorfürVorrichtung zur chemischen Gasphasenabscheidung

    公开(公告)号:EP0747503A1

    公开(公告)日:1996-12-11

    申请号:EP96109191.5

    申请日:1996-06-07

    申请人: EBARA CORPORATION

    IPC分类号: C23C16/44 C30B25/14

    摘要: A reactant gas ejector head for use in a thin-film vapor deposition apparatus includes at least two reactant gas inlet passages (24) for introducing reactant gases, a gas mixing chamber (26) for mixing reactant gases introduced from the reactant gas inlet passages, and a nozzle (27) disposed downstream of the gas mixing chamber for rectifying the mixed gases from the gas mixing chamber into a uniform flow and applying the uniform flow to a substrate.

    摘要翻译: 用于薄膜气相沉积装置的反应气体喷射头包括至少两个用于引入反应气体的反应气体入口通道(24),用于混合从反应气体入口通道引入的反应气体的气体混合室(26) 以及设置在气体混合室下游的喷嘴(27),用于将来自气体混合室的混合气体整流成均匀的流动并将均匀的流体施加到基底。

    Method and apparatus for plating substrate and plating facility
    6.
    发明公开
    Method and apparatus for plating substrate and plating facility 审中-公开
    Verfahren undGerätfürdie Plattierung eines Substrats und Plattierungsanlage

    公开(公告)号:EP1067221A3

    公开(公告)日:2004-09-08

    申请号:EP00114663.8

    申请日:2000-07-07

    申请人: EBARA CORPORATION

    IPC分类号: C25D17/00 C25D7/12 C25D5/08

    摘要: A substrate such as a semiconductor wafer is plated to fill a metal such as copper (Cu) or the like in interconnection grooves defined in the substrate. An apparatus for plating such a substrate has a plating chamber for holding a plating solution, the plating chamber housing an anode that is immersible in the plating solution held by the plating chamber, a plating solution ejector pipe for producing an upward jet of plating solution from a plating solution supplied to the plating chamber from an external source, and a substrate holder for removably holding a substrate and positioning the substrate such that a surface to be plated of the substrate is held in contact with the jet of plating solution. The plating chamber has a plating solution outlet defined in a bottom thereof for discharging a portion of the supplied plating solution via through holes defined in the anode and/or around the anode out of the plating chamber.

    摘要翻译: 电镀衬底如半导体晶片以在衬底中限定的互连槽中填充铜(Cu)等金属。 用于电镀这种基板的装置具有用于保持电镀液的电镀室,电镀室容纳浸入由电镀室保持的镀液中的阳极,用于从电镀液向上喷射电镀溶液的电镀液喷射管 从外部源提供给电镀室的电镀液,以及用于可移除地保持基板并定位基板的基板保持器,使得基板的被镀表面与电镀液的喷射保持接触。 电镀室具有限定在其底部的电镀溶液出口,用于通过限定在阳极中和/或阳极周围的通孔从电镀室排出供给的电镀溶液的一部分。

    Vaporizer apparatus
    9.
    发明公开
    Vaporizer apparatus 失效
    Verdampfungsapparat

    公开(公告)号:EP0808916A2

    公开(公告)日:1997-11-26

    申请号:EP97108398.5

    申请日:1997-05-23

    申请人: EBARA CORPORATION

    IPC分类号: C23C16/00 B01D1/00

    CPC分类号: B01D1/00 C23C16/4481

    摘要: Heat can be supplied effectively to a porous member of a vaporizer apparatus so that the vaporizing operation can be carried out smoothly and efficiently. The vaporizer apparatus comprises a vaporizer section (B) having a porous member (9) including a liquid receiving surface and a vapor discharge surface; a feed supply section (A) for supplying a liquid feed material to the liquid receiving surface of the porous member; a heating medium passage (P1) in thermal contact with the porous member; and a heating medium supply system for flowing a heating medium (L2) of a temperature higher than a vaporization temperature of the liquid feed material, through the heating medium passage.

    摘要翻译: 可以有效地将热量提供给蒸发器装置的多孔构件,从而可以平稳有效地进行蒸发操作。 蒸发器装置包括具有包括液体接收表面和蒸汽排出表面的多孔构件(9)的蒸发器部分(B) 用于将液体供给材料供给到多孔构件的液体接收表面的供料部分(A) 与多孔构件热接触的加热介质通路(P1) 以及用于使高于液体供给材料的蒸发温度的加热介质(L2)流过加热介质通道的加热介质供给系统。

    Liquid material vaporizer apparatus and gas ejection device
    10.
    发明公开
    Liquid material vaporizer apparatus and gas ejection device 失效
    Vorrichtung zum Verdampfen einerFlüssigkeitund Gasausstosseinrichtung

    公开(公告)号:EP0799907A1

    公开(公告)日:1997-10-08

    申请号:EP97105636.1

    申请日:1997-04-04

    申请人: EBARA CORPORATION

    IPC分类号: C23C16/44

    摘要: A vaporizer apparatus is disclosed which enables to efficiently vaporize a liquid material for the production of high dielectric thin film devices by allowing a sufficient dwell time for complete vaporization of the feed liquid, to prevent degradation of the feed gas after vaporization and to provide a stable supply of the vaporized feed gas to the substrate. The vaporizer apparatus comprises an outer member having a cylindrical inner surface, an inner member having a cylindrical outer surface opposing to the cylindrical inner surface of the outer member, and a feed material passage having a spiral configuration is formed on at least one of the cylindrical inner surface and the cylindrical outer surface. The feed material passage communicates with a feed liquid entry opening and a feed gas exit opening. A heating device is provided for heating at least one of the outer member and inner member.

    摘要翻译: 公开了一种蒸发器装置,其能够通过允许足够的停留时间来充分蒸发进料液体,从而有效地蒸发用于生产高电介质薄膜器件的液体材料,以防止蒸发后进料气体的劣化并提供稳定的 将蒸发的进料气体供应到基底。 蒸发器装置包括具有圆柱形内表面的外部构件,具有与外部构件的圆柱形内表面相对的圆柱形外表面的内部构件,并且具有螺旋构造的进给材料通道形成在至少一个圆柱形 内表面和圆柱形外表面。 进料材料通道与进料液入口和进料气体出口开口连通。 提供加热装置用于加热外部构件和内部构件中的至少一个。