发明公开
EP1759422A2 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS
审中-公开
方法与设备可打印的半导体元件的生产和装配
- 专利标题： METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS
- 专利标题（中）： 方法与设备可打印的半导体元件的生产和装配
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申请号： EP05755193.9申请日： 2005-06-02
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公开(公告)号： EP1759422A2公开(公告)日： 2007-03-07
- 发明人: NUZZO, Ralph, G. , ROGERS, John, A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao
- 申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- 申请人地址： 352 Henry Administration Building, 506 South Wright Street Urbana, IL 61801 US
- 专利权人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- 当前专利权人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- 当前专利权人地址： 352 Henry Administration Building, 506 South Wright Street Urbana, IL 61801 US
- 代理机构： Zeuner, Stefan
- 优先权： US577077P 20040604; US601061P 20040811; US650305P 20050204; US663391P 20050318; US677617P 20050504
- 国际公布： WO2005122285 20051222
- 主分类号： H01L31/0312
- IPC分类号： H01L31/0312
摘要：
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
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