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公开(公告)号：EP4040474A1
公开(公告)日：2022-08-10
申请号：EP22164385.1
申请日：2006-06-01
发明人： NUZZO, Ralph , ROGERS, John , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao , KO, Heung Cho , MACK, Shawn
IPC分类号： H01L21/84
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
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2.发明公开PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 有权PRINTABLE半导体结构及制造和组装相关方法
公开(公告)号：EP1915774A2
公开(公告)日：2008-04-30
申请号：EP06771761.1
申请日：2006-06-01
发明人： NUZZO, Ralph G. , ROGERS, John A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao , KO, Heung Cho , MACH, Shawn
IPC分类号： H01L21/20
CPC分类号： H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
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3.发明授权PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 有权可打印的半导体结构及相关的制造和组装方法
公开(公告)号：EP1915774B1
公开(公告)日：2015-05-20
申请号：EP06771761.1
申请日：2006-06-01
发明人： NUZZO, Ralph G. , ROGERS, John A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao , KO, Heung Cho , MACK, Shawn
IPC分类号： H01L21/302 , H05K3/36 , H01R12/00
CPC分类号： H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
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4.发明公开METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 审中-公开方法与设备可打印的半导体元件的生产和装配
公开(公告)号：EP1759422A2
公开(公告)日：2007-03-07
申请号：EP05755193.9
申请日：2005-06-02
发明人： NUZZO, Ralph, G. , ROGERS, John, A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao
IPC分类号： H01L31/0312
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
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5.发明公开CONTROLLED BUCKLING STRUCTURES IN SEMICONDUCTOR INTERCONNECTS AND NANOMEMBRANES FOR STRETCHABLE ELECTRONICS 审中-公开半导体化合物和纳米滤膜控制的化学结构可拉伸的电子文章
公开(公告)号：EP2064710A2
公开(公告)日：2009-06-03
申请号：EP07841968.6
申请日：2007-09-06
发明人： ROGERS, John A. , MEITL, Matthew , SUN, Yugang , KO, Heung Cho , CARLSON, Andrew , CHOI, Won Mook , STOYKOVICH, Mark , JIANG, Hanqing , HUANG, Yonggang , NUZZO, Ralph G. , KANG, Seong Jun , LEE, Keon Jae , ZHU, Zhengtao , MENARD, Etienne , KIM, Hoon-sik , KHANG, Dahl-Young , AHN, Jong-Hyun
CPC分类号： H01L27/0688 , B81B3/0078 , B82Y10/00 , H01L21/6835 , H01L21/8221 , H01L21/8258 , H01L27/0605 , H01L27/1292 , H01L27/1446 , H01L27/281 , H01L29/0665 , H01L29/0673 , H01L29/16 , H01L29/1602 , H01L29/1606 , H01L29/20 , H01L29/7781 , H01L29/7842 , H01L29/78681 , H01L29/78696 , H01L31/0203 , H01L51/0097 , H01L2924/00011 , H01L2924/0002 , H01L2924/13091 , H01L2924/30105 , H05K1/0283 , H05K1/0313 , H05K3/20 , H05K2201/0133 , H05K2201/09045 , H05K2203/0271 , H01L2924/00 , H01L2224/80001 , H01L2924/00012
摘要： In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
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