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1.发明公开COMPOSITE PATTERNING DEVICES FOR SOFT LITHOGRAPHY 有权VERBUNDSTRUKTURIERUNGSVORRICHTUNGENFÜRWEICHE LITHOGRAFIE
公开(公告)号：EP1742893A2
公开(公告)日：2007-01-17
申请号：EP05756327.2
申请日：2005-04-27
发明人： ROGERS, John A. , MENARD, Etienne
CPC分类号： B82Y10/00 , B82Y30/00 , B82Y40/00 , C04B24/383 , C04B28/14 , C04B2111/00181 , G03F7/0002
摘要： The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.
摘要翻译： 本发明提供了用于在衬底表面上制造图案的方法，装置和器件组件，特别是包括具有一维，二维或三维尺寸选定长度的微小尺寸和/或纳米尺寸特征的结构的图案。 本发明提供了包括多个聚合物层的复合图案形成装置，每个聚合物层各自具有选择的机械性能，例如杨氏模量和弯曲刚度，所选择的物理尺寸，例如厚度，表面积和浮雕图案尺寸，以及选定的热性能，例如系数 的热膨胀，以在各种基材表面和表面形态上提供高分辨率图案。
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公开(公告)号：EP4040474A1
公开(公告)日：2022-08-10
申请号：EP22164385.1
申请日：2006-06-01
发明人： NUZZO, Ralph , ROGERS, John , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao , KO, Heung Cho , MACK, Shawn
IPC分类号： H01L21/84
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
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3.发明公开RELEASE STRATEGIES FOR MAKING TRANSFERABLE SEMICONDUCTOR STRUCTURES, DEVICES AND DEVICE COMPONENTS 审中-公开发布策略MAKING转让的半导体结构，设备和-GERÄTEBAUTEILE
公开(公告)号：EP2064734A2
公开(公告)日：2009-06-03
申请号：EP07842903.2
申请日：2007-09-20
发明人： ROGERS, John A. , NUZZO, Ralph G. , MEITL, Matthew , KO, Heung Cho , YOON, Jongseung , MENARD, Etienne , BACA, Alfred J.
IPC分类号： H01L21/28
CPC分类号： H01L31/0735 , B81C1/0046 , B81C2201/0191 , B82Y10/00 , B82Y20/00 , B82Y40/00 , H01L21/7813 , H01L29/155 , H01L29/20 , H01L31/03046 , H01L31/068 , H01L31/0687 , H01L31/072 , H01L31/0725 , H01L31/184 , H01L31/1844 , H01L33/0079 , H01L2924/0002 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T156/1195 , H01L2924/00
摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
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4.发明公开PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 有权PRINTABLE半导体结构及制造和组装相关方法
公开(公告)号：EP1915774A2
公开(公告)日：2008-04-30
申请号：EP06771761.1
申请日：2006-06-01
发明人： NUZZO, Ralph G. , ROGERS, John A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao , KO, Heung Cho , MACH, Shawn
IPC分类号： H01L21/20
CPC分类号： H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
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公开(公告)号：EP2064734B1
公开(公告)日：2019-01-16
申请号：EP07842903.2
申请日：2007-09-20
发明人： ROGERS, John A. , NUZZO, Ralph G. , MEITL, Matthew , KO, Heung Cho , YOON, Jongseung , MENARD, Etienne , BACA, Alfred J.
IPC分类号： H01L29/20 , B81C1/00 , H01L21/78 , H01L31/068 , H01L31/072 , B82Y10/00 , B82Y20/00 , H01L29/15 , B82Y40/00 , H01L31/0687 , H01L31/0725 , H01L31/0304 , H01L31/18 , H01L31/0735
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公开(公告)号：EP2104954A1
公开(公告)日：2009-09-30
申请号：EP07874095.8
申请日：2007-10-31
发明人： ROGERS, John , NUZZO, Ralph , MEITL, Matthew , MENARD, Etienne , BACA, Alfred, J. , MOTALA, Michael , AHN, Jong-Hyun , PARK, Sang-Il , YU, Chang-Jae , KO, Heung, Cho , STOYKOVICH, Mark , YOON, Jongseung
IPC分类号： H01L27/15
CPC分类号： H01L25/50 , B81C2201/0185 , B82Y10/00 , H01L21/00 , H01L25/042 , H01L25/0753 , H01L25/167 , H01L27/1214 , H01L27/124 , H01L27/1285 , H01L27/1292 , H01L27/14627 , H01L27/14636 , H01L27/14643 , H01L29/78603 , H01L29/78681 , H01L31/02005 , H01L31/02008 , H01L31/02168 , H01L31/02325 , H01L31/02327 , H01L31/0288 , H01L31/03046 , H01L31/043 , H01L31/0525 , H01L31/0543 , H01L31/0547 , H01L31/0693 , H01L31/0725 , H01L31/167 , H01L31/1804 , H01L31/1824 , H01L31/1868 , H01L31/1876 , H01L31/1892 , H01L33/005 , H01L33/0079 , H01L33/06 , H01L33/30 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01S5/021 , H01S5/02284 , H01S5/183 , H01S5/3013 , H01S5/34326 , H01S5/423 , Y02E10/52 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.
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公开(公告)号：EP2100192A2
公开(公告)日：2009-09-16
申请号：EP07863549.7
申请日：2007-10-26
发明人： ROGERS, John A. , MENARD, Etienne
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F1/50 , H01L51/0017
摘要： The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions and including relief and recess features with variable height, depth or height and depth. Composite patterning devices comprising a plurality of polymer layers each having selected mechanical and thermal properties and physical dimensions provide high resolution patterning on a variety of substrate surfaces and surface morphologies. Gray-scale ink lithography photomasks for gray-scale pattern generation or molds for generating embossed relief features on a substrate surface are provided. The particular shape of the fabricated patterned can be manipulated by varying the three-dimensional recess pattern on an elastomeric patterning device which is brought into conformal contact with a substrate to localize patterning agent to the recess portion of the pattern.
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8.发明公开CONTROLLED BUCKLING STRUCTURES IN SEMICONDUCTOR INTERCONNECTS AND NANOMEMBRANES FOR STRETCHABLE ELECTRONICS 审中-公开半导体化合物和纳米滤膜控制的化学结构可拉伸的电子文章
公开(公告)号：EP2064710A2
公开(公告)日：2009-06-03
申请号：EP07841968.6
申请日：2007-09-06
发明人： ROGERS, John A. , MEITL, Matthew , SUN, Yugang , KO, Heung Cho , CARLSON, Andrew , CHOI, Won Mook , STOYKOVICH, Mark , JIANG, Hanqing , HUANG, Yonggang , NUZZO, Ralph G. , KANG, Seong Jun , LEE, Keon Jae , ZHU, Zhengtao , MENARD, Etienne , KIM, Hoon-sik , KHANG, Dahl-Young , AHN, Jong-Hyun
CPC分类号： H01L27/0688 , B81B3/0078 , B82Y10/00 , H01L21/6835 , H01L21/8221 , H01L21/8258 , H01L27/0605 , H01L27/1292 , H01L27/1446 , H01L27/281 , H01L29/0665 , H01L29/0673 , H01L29/16 , H01L29/1602 , H01L29/1606 , H01L29/20 , H01L29/7781 , H01L29/7842 , H01L29/78681 , H01L29/78696 , H01L31/0203 , H01L51/0097 , H01L2924/00011 , H01L2924/0002 , H01L2924/13091 , H01L2924/30105 , H05K1/0283 , H05K1/0313 , H05K3/20 , H05K2201/0133 , H05K2201/09045 , H05K2203/0271 , H01L2924/00 , H01L2224/80001 , H01L2924/00012
摘要： In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
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9.发明授权PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 有权可打印的半导体结构及相关的制造和组装方法
公开(公告)号：EP1915774B1
公开(公告)日：2015-05-20
申请号：EP06771761.1
申请日：2006-06-01
发明人： NUZZO, Ralph G. , ROGERS, John A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao , KO, Heung Cho , MACK, Shawn
IPC分类号： H01L21/302 , H05K3/36 , H01R12/00
CPC分类号： H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
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公开(公告)号：EP1742893B1
公开(公告)日：2012-10-10
申请号：EP05756327.2
申请日：2005-04-27
发明人： ROGERS, John A. , MENARD, Etienne
CPC分类号： B82Y10/00 , B82Y30/00 , B82Y40/00 , C04B24/383 , C04B28/14 , C04B2111/00181 , G03F7/0002
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