发明公开
- 专利标题： LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS
- 专利标题（中）： 光刻采用硅表格科
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申请号： EP05793402.8申请日： 2005-08-31
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公开(公告)号： EP1803033A2公开(公告)日： 2007-07-04
- 发明人: BAHADUR, Maneesh , CHEN, Wei , ALBAUGH, John , HARKNESS, Brian , TONGE, James
- 申请人： Dow Corning Corporation
- 申请人地址： 2200 West Salzburg Road Midland MI 48686-0994 US
- 专利权人： Dow Corning Corporation
- 当前专利权人： Dow Corning Corporation
- 当前专利权人地址： 2200 West Salzburg Road Midland MI 48686-0994 US
- 代理机构： Kyle, Diana
- 优先权： US609425P 20040913
- 国际公布： WO2006031455 20060323
- 主分类号： G03F7/00
- IPC分类号： G03F7/00 ; G03F7/027 ; G03F7/004
摘要：
A method includes the steps of: A) filling a silicone mold having a patterned surface with a curable (meth)acrylate formulation, B) curing the curable (meth)acrylate formulation to form a patterned feature, C) separating the silicone mold and the patterned feature, optionally D) etching the patterned feature, and optionally E) repeating steps A) to D) reusing the silicone mold. The curable (meth)acrylate formulation contains a fluorofunctional (meth)acrylate, a (meth)acrylate, and a photoinitiator.
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