发明公开
EP1818427A3 Improved method for the direct metallization of non-conductive substrates
审中-公开
改进了对不导电基底的直接金属化法
- 专利标题： Improved method for the direct metallization of non-conductive substrates
- 专利标题（中）： 改进了对不导电基底的直接金属化法
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申请号： EP07002034.2申请日： 2007-01-31
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公开(公告)号： EP1818427A3公开(公告)日： 2009-02-25
- 发明人: Königshofen, Andreas, Dr. , Kesseler, Corinna
- 申请人： ENTHONE, INCORPORATED
- 申请人地址： 350 Frontage Road West Haven, CT 06516 US
- 专利权人： ENTHONE, INCORPORATED
- 当前专利权人： ENTHONE, INCORPORATED
- 当前专利权人地址： 350 Frontage Road West Haven, CT 06516 US
- 代理机构： Stenger, Watzke & Ring
- 优先权： DE102006005684 20060208
- 主分类号： C25D5/54
- IPC分类号： C25D5/54 ; C25D3/12 ; C25D3/38
摘要：
The present invention relates to an improved method for the metallization of an electrically non-conductive substrate using a thiosulphate conductor. According to the invention, thiosulphate conductors are used in combination with compounds of the ions of the group consisting of lithium, potassium, rubidium, caesium or mixtures thereof.
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