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公开(公告)号：EP2196563B1
公开(公告)日：2013-04-03
申请号：EP08021571.8
申请日：2008-12-12
发明人： Eckert, Hans Ullrich , Ryl, Michael
IPC分类号： C25D3/50 , C25D3/56 , C25D5/48 , C23C18/44 , C23C26/00 , C23C28/00 , C23F11/16 , C23C18/18 , C23C18/48 , C23C18/16 , C25D5/18
CPC分类号： C25D3/50 , C23C18/1601 , C23C18/1658 , C23C18/166 , C23C18/1689 , C23C18/1841 , C23C18/44 , C23C18/48 , C23C26/00 , C23C28/023 , C23F11/161 , C25D3/567 , C25D5/18 , C25D5/48
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公开(公告)号：EP1969160B1
公开(公告)日：2011-04-27
申请号：EP06701821.8
申请日：2006-01-06
发明人： KÖNIGSHOFEN, Andreas , ELBICK, Danica , WERNER, Christoph , CLAUBERG, Wolfgang , PIES, Peter , MÖBIUS, Andreas
摘要： The present invention relates to an electrolyte and a process for depositing a matt metal layer on a substrate from an electrolyte comprising an emulsion and/or dispersion former or a wetting agent. According to the invention, many metals having differing degrees of mattness can be produced by emulsion and/or dispersion formation in the electrolyte by means of addition of polyalkylene oxides or derivatives thereof, wetting agents having fluorinated or perfluorinated hydrophobic chains or quaternary ammonium compounds substituted by polyalkylene oxide. Furthermore, polytetrafluoroethylene particles can be added to the electrolyte in order to alter the surface properties of the matt layers deposited.
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公开(公告)号：EP1230034B1
公开(公告)日：2010-09-08
申请号：EP00978519.7
申请日：2000-11-09
发明人： BELL, Jane , HEYER, Joachim , HUPE, Jurgen , KALKER, Ingo , KLEINFELD, Marlies
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公开(公告)号：EP1979511A2
公开(公告)日：2008-10-15
申请号：EP07703047.6
申请日：2007-01-26
CPC分类号： C23C18/1683 , C23C18/1617 , C23C18/36 , C25D21/12 , C25D21/14
摘要： The invention relates to a method for coating substrate surfaces with a metal or oxide layer in a coating bath. Said bath has at least one component the concentration of which changes during the coating process and which therefore has to be replenished or removed in order to maintain the quality of the bath. The method according to the invention is characterized in that the component is replenished and/or removed depending on the strength of the composition of the bath.
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5.发明公开
公开(公告)号：EP1861208A2
公开(公告)日：2007-12-05
申请号：EP06735354.0
申请日：2006-02-17
发明人： CHEN, Qingyun c/o Enthone Inc. , HURTUBISE, Richard c/o Enthone Inc. , WITT, Christian c/o Enthone Inc. , ABYS, Joseph, A. c/o Enthone Inc. , STRITCH, Daniel c/o Enthone Inc. , VALVERDE, Charles c/o Enthone Inc.
IPC分类号： B05D1/18
摘要： A method for electrolessly filling a stacked memory cell interconnect feature comprising electroless deposition from a composition comprising Co ions and a reducing agent by bottom-up filling initiated by reduction to Co metal on an electrically conducting bottom of the feature. An electroless deposition composition for electrolessly depositing Co in a high aspect ratio stacked memory cell interconnect feature, the composition comprising water, Co ions, a complexing agent, a buffering agent, a borane-based reducing agent component, and a hypophosphite reducing agent component. There is a concentration ratio of borane-based reducing agent to hypophosphite reducing agent of less than about 0.5.
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公开(公告)号：EP1230034A1
公开(公告)日：2002-08-14
申请号：EP00978519.7
申请日：2000-11-09
发明人： BELL, Jane , HEYER, Joachim , HUPE, Jurgen , KALKER, Ingo , KLEINFELD, Marlies
IPC分类号： B05D1/18
摘要： The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the tin layer.
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7.发明授权COMPOSITION AND PROCESS FOR CONDITIONING THE SURFACE OF PLASTIC SUBSTRATES PRIOR TO METAL PLATING 失效用于调整金属镀层前塑料基材表面的组成和工艺
公开(公告)号：EP0187150B1
公开(公告)日：1991-11-06
申请号：EP85902778.1
申请日：1985-05-08
CPC分类号： H05K3/381 , C23C18/22 , H05K3/0055 , H05K3/181 , H05K2203/0783 , H05K2203/0789 , H05K2203/0793 , H05K2203/0796 , H05K2203/122
摘要： An alkaline composition for enhancing the adhesiveness of metal plating to a plastic substrate comprising: (a) a compound represented by general formula (I), and (b) a compound represented by general formula (II), wherein R1, R2, R3, and R4 are independently selected from the group consisting of hydrogen atoms, aryl groups and alkyl groups of 1-4 carbon atoms, m is 0 to 2 and n is 2 to 5; the compositions comprising, by weight, about 10 gram/liter (g/l) to saturation compound (a) and about 10g/l to saturation compound (b). The composition is preferably employed before alkaline permanganete etching of the plastic, followed by electroless metal plating using conventional techniques.
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公开(公告)号：EP0153369A1
公开(公告)日：1985-09-04
申请号：EP84903142.0
申请日：1984-08-08
IPC分类号： C23C18
CPC分类号： C23C18/1651
摘要： Procédé pour améliorer le nickelage non galvanique d'aluminium qui a été prétraité avec un revêtement barrière comme du zinc, en utilisant de multiples bains de placage sous conditions de fonctionnement regulées.
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9.发明公开FLEXIBLE COLOR ADJUSTMENT FOR DARK CR(III)-PLATINGS 审中-公开灵活的FARBEINSTELLUNGFÜRDUNKLE CR（III）-PLATTIERUNGEN
公开(公告)号：EP3147388A1
公开(公告)日：2017-03-29
申请号：EP15186811.4
申请日：2015-09-25
摘要： The invention relates to a process for the adjustment of the lightness L* of electrolytically deposited chromium-finishes on workpieces obtained by an electroplating bath at least comprising chromium(III)-ions and sulfur containing organic compounds, wherein the concentration of the sulfur containing organic compounds in the bath is adjusted by passing at least a part of the bath composition through an activated carbon filter.
摘要翻译： 本发明涉及一种通过至少包含铬（III）和含硫有机化合物的电镀浴获得的工件上的电解沉积铬涂层的亮度L *的调节方法，其中含硫有机物 通过使至少一部分浴组合物通过活性炭过滤器来调节浴中的化合物。
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10.发明授权
公开(公告)号：EP2480612B1
公开(公告)日：2013-03-06
申请号：EP11709650.3
申请日：2011-03-21
发明人： KIMURA, Yasuhiro , YAEGASHI, Hideaki , MATSUDA, Shinji , WESSLING, Bernhard , POSDORFER, Jörg , SCHWARZENBERG, Monika , NISSEN, Stephan , SUGAWARA, Soichiro
IPC分类号： C09D5/08 , C09D191/06
CPC分类号： C09D5/08 , C09D191/06 , Y10T428/12569 , Y10T428/1352 , Y10T428/24612 , Y10T428/31714 , C08L79/02 , C08L91/02
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