发明公开
- 专利标题： Printed wiring board and method of manufacturing the same
- 专利标题（中）： 印刷线路板及其制造方法
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申请号： EP07075318.1申请日： 1998-01-23
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公开(公告)号： EP1827065A3公开(公告)日： 2007-10-10
- 发明人: Takada, Masaru c/o Ibiden Co., Ltd. , Tsukada, Kiyotaka c/o Ibiden Co., Ltd. , Kobayashi, Hiroyuki c/o Ibiden Co., Ltd. , Minoura, Hisashi c/o Ibiden Co., Ltd. , Ukai, Yoshikazu c/o Ibiden Co., Ltd. , Kondo, Mitsuhiro c/o Ibiden Co., Ltd.
- 申请人： IBIDEN CO., LTD.
- 申请人地址： 1, Kanda-cho 2-chome Ogaki-shi, Gifu-ken 503 JP
- 专利权人： IBIDEN CO., LTD.
- 当前专利权人： IBIDEN CO., LTD.
- 当前专利权人地址： 1, Kanda-cho 2-chome Ogaki-shi, Gifu-ken 503 JP
- 代理机构： Jenkins, Peter David
- 优先权： JP3563397 19970203; JP4724897 19970213; JP4988397 19970217; JP5248297 19970219; JP5248397 19970219; JP5248497 19970219; JP6192197 19970227; JP6551197 19970303; JP6915897 19970305; JP8578697 19970319; JP36726897 19971224
- 主分类号： H05K3/00
- IPC分类号： H05K3/00 ; H05K1/02 ; H05K3/46
摘要：
A method of producing a printed wiring board (3) comprising a mounting recess portion (1) for mounting an electronic part, a conductor pattern (7), and a heat-sink plate (6) arranged at the bottom of the mounting recess portion (1), characterized in that a conductor pattern (7) is formed on an insulating substrate (5);
a heat-sink plate (6) is adhered to a lower face of a portion of the insulating substrate (5) forming the mounting recess portion; and
a laser beam (2) is irradiated to an upper face of the portion (10) forming the mounting recess portion to form a mounting recess portion (1).
a heat-sink plate (6) is adhered to a lower face of a portion of the insulating substrate (5) forming the mounting recess portion; and
a laser beam (2) is irradiated to an upper face of the portion (10) forming the mounting recess portion to form a mounting recess portion (1).
公开/授权文献
- EP1827065A2 Printed wiring board and method of manufacturing the same 公开/授权日：2007-08-29
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