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公开(公告)号：EP1827068A3
公开(公告)日：2007-10-03
申请号：EP07075317.3
申请日：1998-01-23
申请人： IBIDEN CO., LTD.
发明人： Takada, Masaru c/o Ibiden Co., Ltd. , Tsukada, Kiyotaka c/o Ibiden Co., Ltd. , Kobayashi, Hiroyuki c/o Ibiden Co., Ltd. , Minoura, Hisashi c/o Ibiden Co., Ltd. , Ukai, Yoshikazu c/o Ibiden Co., Ltd. , Kondo, Mitsuhiro c/o Ibiden Co., Ltd.
CPC分类号： H05K3/4652 , H01L21/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H05K1/0203 , H05K1/021 , H05K1/0271 , H05K1/0366 , H05K1/112 , H05K1/116 , H05K1/182 , H05K3/0035 , H05K3/0061 , H05K3/3468 , H05K3/3484 , H05K3/385 , H05K3/4038 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/428 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K2201/0305 , H05K2201/0394 , H05K2201/09472 , H05K2201/09509 , H05K2201/09518 , H05K2201/0969 , H05K2201/09781 , H05K2201/09845 , H05K2201/09854 , H05K2201/09863 , H05K2203/0315 , H05K2203/041 , H05K2203/0554 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014
摘要： A printed wiring board (802) comprising an insulating substrate (806), a conductor pattern formed on a surface of the insulating substrate (806), a solder filling hole (801) passing through the insulating substrate (806) and arriving at an upper surface of the conductor pattern (851) and a solder (807) filled in the solder filling hole (801), characterized in that the insulating substrate (806) includes fibers (861) therein, and end portions (863) of the fibers (861) protrude from a wall face (810) of the solder filling hole (801) and encroach into the solder (807).
摘要翻译： 一种印刷线路板（802），包括：绝缘基板（806）;在绝缘基板（806）的表面上形成的导体图案;贯通绝缘基板（806）并到达上部 （801）和填充在所述焊料填充孔（801）中的焊料（807），其特征在于，所述绝缘基底（806）中包括纤维（861），所述纤维（861）的端部（863） 861）从焊料填充孔（801）的壁面（810）突出并侵入到焊料（807）中。
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2.发明公开Printed wiring board and method of manufacturing the same 失效Herstellungsverfahrenfüreine Leiterplatte
公开(公告)号：EP1827065A2
公开(公告)日：2007-08-29
申请号：EP07075318.1
申请日：1998-01-23
申请人： IBIDEN CO., LTD.
发明人： Takada, Masaru c/o Ibiden Co., Ltd. , Tsukada, Kiyotaka c/o Ibiden Co., Ltd. , Kobayashi, Hiroyuki c/o Ibiden Co., Ltd. , Minoura, Hisashi c/o Ibiden Co., Ltd. , Ukai, Yoshikazu c/o Ibiden Co., Ltd. , Kondo, Mitsuhiro c/o Ibiden Co., Ltd.
CPC分类号： H05K3/4652 , H01L21/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H05K1/0203 , H05K1/021 , H05K1/0271 , H05K1/0366 , H05K1/112 , H05K1/116 , H05K1/182 , H05K3/0035 , H05K3/0061 , H05K3/3468 , H05K3/3484 , H05K3/385 , H05K3/4038 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/428 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K2201/0305 , H05K2201/0394 , H05K2201/09472 , H05K2201/09509 , H05K2201/09518 , H05K2201/0969 , H05K2201/09781 , H05K2201/09845 , H05K2201/09854 , H05K2201/09863 , H05K2203/0315 , H05K2203/041 , H05K2203/0554 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014
摘要： A method of producing a printed wiring board (3) comprising a mounting recess portion (1) for mounting an electronic part, a conductor pattern (7), and a heat-sink plate (6) arranged at the bottom of the mounting recess portion (1), characterized in that a conductor pattern (7) is formed on an insulating substrate (5);
a heat-sink plate (6) is adhered to a lower face of a portion of the insulating substrate (5) forming the mounting recess portion; and
a laser beam (2) is irradiated to an upper face of the portion (10) forming the mounting recess portion to form a mounting recess portion (1).摘要翻译： 一种印刷电路板（3）的制造方法，其特征在于，具备安装电子部件的安装凹部（1），导体图案（7），以及配置在安装凹部的底部的散热板 （1），其特征在于，在绝缘基板（5）上形成导体图案（7）。 散热板（6）粘附到形成安装凹部的绝缘基板（5）的一部分的下表面; 并且激光束（2）照射到形成安装凹部的部分（10）的上表面以形成安装凹部（1）。
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公开(公告)号：EP1827065A3
公开(公告)日：2007-10-10
申请号：EP07075318.1
申请日：1998-01-23
申请人： IBIDEN CO., LTD.
发明人： Takada, Masaru c/o Ibiden Co., Ltd. , Tsukada, Kiyotaka c/o Ibiden Co., Ltd. , Kobayashi, Hiroyuki c/o Ibiden Co., Ltd. , Minoura, Hisashi c/o Ibiden Co., Ltd. , Ukai, Yoshikazu c/o Ibiden Co., Ltd. , Kondo, Mitsuhiro c/o Ibiden Co., Ltd.
CPC分类号： H05K3/4652 , H01L21/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H05K1/0203 , H05K1/021 , H05K1/0271 , H05K1/0366 , H05K1/112 , H05K1/116 , H05K1/182 , H05K3/0035 , H05K3/0061 , H05K3/3468 , H05K3/3484 , H05K3/385 , H05K3/4038 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/428 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K2201/0305 , H05K2201/0394 , H05K2201/09472 , H05K2201/09509 , H05K2201/09518 , H05K2201/0969 , H05K2201/09781 , H05K2201/09845 , H05K2201/09854 , H05K2201/09863 , H05K2203/0315 , H05K2203/041 , H05K2203/0554 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014
摘要： A method of producing a printed wiring board (3) comprising a mounting recess portion (1) for mounting an electronic part, a conductor pattern (7), and a heat-sink plate (6) arranged at the bottom of the mounting recess portion (1), characterized in that a conductor pattern (7) is formed on an insulating substrate (5);
a heat-sink plate (6) is adhered to a lower face of a portion of the insulating substrate (5) forming the mounting recess portion; and
a laser beam (2) is irradiated to an upper face of the portion (10) forming the mounting recess portion to form a mounting recess portion (1).摘要翻译： 一种印刷线路板（3）的制造方法，该印刷线路板（3）包括用于安装电子部件的安装凹部（1），导体图案（7）和布置在安装凹部的底部的散热板（6） （1），其特征在于，在绝缘基板（5）上形成导体图案（7）。 散热板（6）粘附到形成安装凹部的绝缘基板（5）的一部分的下表面; 并且激光束（2）照射到形成安装凹部的部分（10）的上表面以形成安装凹部（1）。
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4.发明公开Printed wiring board and method of manufacturing the same 失效Leiterplatte und Herstellungsverfahrendafür
公开(公告)号：EP1827068A2
公开(公告)日：2007-08-29
申请号：EP07075317.3
申请日：1998-01-23
申请人： IBIDEN CO., LTD.
发明人： Takada, Masaru c/o Ibiden Co., Ltd. , Tsukada, Kiyotaka c/o Ibiden Co., Ltd. , Kobayashi, Hiroyuki c/o Ibiden Co., Ltd. , Minoura, Hisashi c/o Ibiden Co., Ltd. , Ukai, Yoshikazu c/o Ibiden Co., Ltd. , Kondo, Mitsuhiro c/o Ibiden Co., Ltd.
CPC分类号： H05K3/4652 , H01L21/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H05K1/0203 , H05K1/021 , H05K1/0271 , H05K1/0366 , H05K1/112 , H05K1/116 , H05K1/182 , H05K3/0035 , H05K3/0061 , H05K3/3468 , H05K3/3484 , H05K3/385 , H05K3/4038 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/428 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K2201/0305 , H05K2201/0394 , H05K2201/09472 , H05K2201/09509 , H05K2201/09518 , H05K2201/0969 , H05K2201/09781 , H05K2201/09845 , H05K2201/09854 , H05K2201/09863 , H05K2203/0315 , H05K2203/041 , H05K2203/0554 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014
摘要： A printed wiring board (802) comprising an insulating substrate (806), a conductor pattern formed on a surface of the insulating substrate (806), a solder filling hole (801) passing through the insulating substrate (806) and arriving at an upper surface of the conductor pattern (851) and a solder (807) filled in the solder filling hole (801), characterized in that the insulating substrate (806) includes fibers (861) therein, and end portions (863) of the fibers (861) protrude from a wall face (810) of the solder filling hole (801) and encroach into the solder (807).
摘要翻译： 一种印刷电路板（802），包括绝缘基板（806），形成在所述绝缘基板（806）的表面上的导体图案，穿过所述绝缘基板（806）并到达所述绝缘基板 导体图案（851）的表面和填充在焊料填充孔（801）中的焊料（807），其特征在于，绝缘基板（806）包括纤维（861），纤维的端部（863） 861）从焊料填充孔（801）的壁面（810）突出并侵入焊料（807）。
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