发明公开
- 专利标题： TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE
- 专利标题（中）： 锡银LOTBEULEN电子制造业
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申请号： EP06801412.5申请日： 2006-08-14
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公开(公告)号： EP1946362A2公开(公告)日： 2008-07-23
- 发明人: RICHARDSON, Thomas, B. , KLEINFELD, Marlies , RIETMANN, Christian , ZAVARINE, Igor , STEINIUS, Ortrud , ZHANG, Yun , ABYS, Joseph, A.
- 申请人： ENTHONE, INCORPORATED
- 申请人地址： 350 Frontage Road West Haven, CT 06516 US
- 专利权人： ENTHONE, INCORPORATED
- 当前专利权人： ENTHONE, INCORPORATED
- 当前专利权人地址： 350 Frontage Road West Haven, CT 06516 US
- 代理机构： Stenger, Watzke & Ring
- 优先权： US708328P 20050815; US463355 20060809
- 国际公布： WO2007022075 20070222
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A process for forming a solder bump on an under bump metal structure in the manufacture of a microelectronic device comprising exposing the under bump metal structure to an electrolytic bath comprising a source of Sn2+ ions, a source of Ag+ ions, a thiourea compound and/or a quaternary ammonium surfactant; and supplying an external source of electrons to the electrolytic bath to deposit a Sn—Ag alloy onto the under bump metal structure.
公开/授权文献
- EP1946362B1 TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE 公开/授权日：2012-01-11
信息查询
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