发明公开
- 专利标题： Thermal dissipation system for portable electronic devices
- 专利标题（中）： 热敏电阻系统电子电气系统Vorrichtungen
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申请号： EP08104939.7申请日： 2006-03-07
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公开(公告)号： EP1993337A3公开(公告)日： 2009-02-25
- 发明人: Smalc, Martin David , Shives, Gary D. , Reynolds, Robert Anderson, III
- 申请人： GrafTech International Holdings Inc.
- 申请人地址： 12900 Snow Road Parma, OH 44130 US
- 专利权人： GrafTech International Holdings Inc.
- 当前专利权人： GrafTech International Holdings Inc.
- 当前专利权人地址： 12900 Snow Road Parma, OH 44130 US
- 代理机构： Brand, Thomas Louis
- 优先权： US176596 20050707
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A thermal solution for a portable electronic device, which is position between a heat source and another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the second component from the heat generated by the heat source.
公开/授权文献
- EP1993337B1 Thermal dissipation system for portable electronic devices 公开/授权日：2011-11-02
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