A pressure sensor (10) for use in a harsh environment including a substrate (14) and a sensor die (12) directly coupled to the substrate (14) by a bond frame (70) positioned between the substrate (14) and the sensor die (12). The sensor die (12) includes a generally flexible diaphragm (16) configured to flex when exposed to a sufficient differential pressure thereacross. The sensor (10) further includes a piezoelectric or piezoresistive sensing element (46) at least partially located on the diaphragm (16) such that the sensing element (46) provides an electrical signal upon flexure of the diaphragm (16). The sensor (10) also includes an connecting component (22) electrically coupled to the sensing element (46) at a connection location that is fluidly isolated from the diaphragm (16) by the bond frame (70). The bond frame (70) is made of materials and the connecting component (22) is electrically coupled to the sensing element (46) by the same materials of the bond frame (70).