发明授权
- 专利标题： Wireless IC device and component for wireless IC device
- 专利标题（中）： 无线IC器件和用于无线IC器件的组件
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申请号： EP10166024.9申请日： 2007-01-12
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公开(公告)号： EP2226893B8公开(公告)日： 2014-10-08
- 发明人: Dokai, Yuya , Kato, Noboru , Ishino, Satoshi
- 申请人： MURATA MANUFACTURING CO., LTD.
- 申请人地址： 10-1, Higashikotari 1-chome Nagaokakyo-shi, Kyoto 617-8555 JP
- 专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址： 10-1, Higashikotari 1-chome Nagaokakyo-shi, Kyoto 617-8555 JP
- 代理机构： Zimmermann, Tankred Klaus
- 优先权： JP2006011626 20060119; JP2006079099 20060322; JP2006146258 20060526; JP2006182685 20060630; JP2006236777 20060831
- 主分类号： H01Q1/38
- IPC分类号： H01Q1/38 ; H01Q9/16 ; H01Q1/22 ; G06K19/07 ; G06K19/077 ; H04B5/02
摘要：
A wireless IC device comprises a wireless IC chip (5), a power supply circuit board (140) connected to the wireless IC chip and a radiation plate (20), to which the power supply circuit board is adhered or disposed adjacent thereto. The power supply circuit board includes a power supply circuit including a resonant circuit having a predetermined resonant frequency. The radiation plate is arranged to perform at least one of radiation of a transmission signal supplied from the power supply circuit, and receiving of a reception signal and supplying of the reception signal to the power supply circuit. The resonant circuit is a distributed-constant resonant circuit.
公开/授权文献
- EP2226893B1 Wireless IC device and component for wireless IC device 公开/授权日：2014-07-23
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