发明公开
- 专利标题： ALUMINUM RIBBON FOR ULTRASONIC BONDING
- 专利标题（中）： ALUMINIUMBANDFÜRULTRASCHALLSCHWEISSUNGEN
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申请号： EP09804793.9申请日： 2009-05-01
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公开(公告)号： EP2315240A1公开(公告)日： 2011-04-27
- 发明人: MIKAMI Michitaka , KIKUCHI Teruo , HIRATA Yuichi , NAKASHIMA Shinichiro , SATOU Matsumi , KIMURA Keisuke
- 申请人： Tanaka Denshi Kogyo K.K.
- 申请人地址： Tokyo Building 22F 7-3 Marunouchi 2-chome Chiyoda-ku Tokyo 100-6422 JP
- 专利权人： Tanaka Denshi Kogyo K.K.
- 当前专利权人： Tanaka Denshi Kogyo K.K.
- 当前专利权人地址： Tokyo Building 22F 7-3 Marunouchi 2-chome Chiyoda-ku Tokyo 100-6422 JP
- 代理机构： Hössle Patentanwälte Partnerschaft
- 优先权： JP2008201994 20080805
- 国际公布： WO2010016306 20100211
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
To provide a bonding ribbon which can be realized the stable bonding strength, which has a homogeneous whole bonded surface every time for several ten thousands bonding cycles.
An aluminum ribbon for ultrasonic bonding comprising: an aluminum alloy is more than 99 wt % of Al, it contains additive elements and residual aluminum, wherein it has ultra thin tape structure roll rolled after multi stages drawing, wherein the average crystal grain size at a cross section of the ribbon is 5 - 200 µm, wherein it is featured the ratio of the thickness to the width is 1/2 - 1/20.
It is preferable that the aspect ratio of crystal grain (width direction/thickness direction) is 0.5 - 10 and the surface of the tape is mirror-finished wherein the surface roughness R z is less than 2 µm and/or equals to 2 µm.
An aluminum ribbon for ultrasonic bonding comprising: an aluminum alloy is more than 99 wt % of Al, it contains additive elements and residual aluminum, wherein it has ultra thin tape structure roll rolled after multi stages drawing, wherein the average crystal grain size at a cross section of the ribbon is 5 - 200 µm, wherein it is featured the ratio of the thickness to the width is 1/2 - 1/20.
It is preferable that the aspect ratio of crystal grain (width direction/thickness direction) is 0.5 - 10 and the surface of the tape is mirror-finished wherein the surface roughness R z is less than 2 µm and/or equals to 2 µm.
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