公开(公告)号：EP3001519A1

公开(公告)日：2016-03-30

申请号：EP14801406.1

申请日：2014-05-21

申请人： DENSO CORPORATION ,  Tanaka Denshi Kogyo K.K.

发明人： MURAYAMA, Yuki ,  ABE, Nobuo ,  SAKAIRI, Koichi ,  TANAKA, Kunihiro

IPC分类号： H01T13/20

CPC分类号： H01T13/39 ,  H01T21/02

摘要： A method of manufacturing a spark plug 1 in which at least one of a center electrode 2 and a ground electrode 3 includes a discharge chip 5. In a chip making step, the discharge chip 5 is made by joining a discharge part 51 arranged on a spark discharge gap 11 side and a base member-joining part 52 that is made of a material having a lower melting point than the discharge part 51 and to be joined to an electrode base member 30. In a temporary joining step, the discharge chip 5 is temporarily joined, at the base member-joining part 52, to the electrode base member 30 by resistance welding. In a main joining step, the discharge chip 5 is joined, by laser welding, to the electrode base member 30 so that a side surface 511 of the discharge part 51 and a surface 31 of the electrode base member 30 are smoothly connected by a connecting surface 523 that has no sharp edge.

摘要翻译： 一种制造火花塞1的方法，其中中心电极2和接地电极3中的至少一个包括放电芯片5.在芯片制造步骤中，放电芯片5通过将布置在放电芯片 火花放电间隙11侧和由具有比排出部51低的熔点的材料制成并与电极基体30接合的基体构件接合部52.在暂时接合步骤中，放电芯片5 通过电阻焊接在基部构件接合部52暂时接合到电极基体部件30。 在主接合步骤中，通过激光焊接将放电芯片5接合到电极基体部件30，使得放电部分51的侧表面511和电极基底部件30的表面31通过连接 没有锋利边缘的表面523。

公开(公告)号：EP3651187A1

公开(公告)日：2020-05-13

申请号：EP18828058.0

申请日：2018-07-03

申请人： Tanaka Denshi Kogyo K.K.

发明人： KIMURA, Nobuyuki ,  OTSU, Sachihiro ,  YANAI, Hirofumi

IPC分类号： H01L21/60

摘要： An object of the present invention is to provide a winding spool for bonding wires, a winding structure for the winding spool, and a spool case for storing the spool, wherein a bonding wire wound on the spool has excellent unwinding properties against vibration and impacts occurring during long-distance transportation or attachment to a bonding device. The winding spool of the present invention is a winding spool for a bonding wire, the winding spool being made of a synthetic resin and comprising a perforated guide portion, a drum portion, and flange portions, wherein an inner surface of each flange portion has an inclined portion having an elevation angle of 76 degrees or more and 86 degrees or less, and the inclined portion has a vertical height (h) that is 50% or more of a vertical height (H) of the entire inner surface of the flange portion, whereby the problems can be solved. Moreover, a larger impact can be solved by the winding structure of a bonding wire of the present invention; that is, the height of an edge of the drum portion on which the bonding wire is wound is higher than the height of the center of the drum portion. In addition, a further larger impact can be solved by using the spool case for winding spools of the present invention. That is, in the spool case for winding spools comprising a cover portion and a body made of a synthetic resin, the body has an approximately square pyramid trapezoidal shape with an opening on a side of the cover portion, and side facing surfaces of the body each have one or more expanded portions.

公开(公告)号：EP2208801B1

公开(公告)日：2012-04-04

申请号：EP08846565.3

申请日：2008-09-11

申请人： Tanaka Denshi Kogyo K.K.

发明人： MURAI, Hiroshi ,  CHIBA, Jun ,  AMADA, Fujio

IPC分类号： C22C5/02 ,  B23K35/30 ,  H01L23/00 ,  H01L21/60

CPC分类号： C22C5/02 ,  B23K35/3013 ,  H01L24/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/78306 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/01071 ,  H01L2924/00014 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/20752 ,  H01L2924/00013 ,  H01L2924/01006

摘要： [Issues to be solved] Second bonding failures caused attached oxide of additive elements on high purity Au bonding wire are to be dissolved. [Solution means] Au alloy bonding wires comprising: 5 - 100 wt ppm Mg, 5 - 20 wt ppm In, 5 - 20 wt ppm Al, 5 - 20 wt ppm Yb, and Au residual is more than 99.995 wt % purity, and adding 5 - 20 wt ppm Ca, and for these alloys adding at least more than one element among 5 - 20 wt ppm La, 5 - 20 wt ppm Lu, 5 - 100 wt ppm Sn, 5 - 100 wt ppm Sr to the alloy, and/or, more over, adding 0.01 - 1.2 wt % Pd to these alloys. Bonding wire, which contains these trace additive elements .do not cause of disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding to attached on tip of capillary, transferring to the wire at second bonding.

公开(公告)号：EP2208801A1

公开(公告)日：2010-07-21

申请号：EP08846565.3

申请日：2008-09-11

申请人： Tanaka Denshi Kogyo K.K.

发明人： MURAI, Hiroshi ,  CHIBA, Jun ,  AMADA, Fujio

IPC分类号： C22C5/02 ,  H01L21/60

CPC分类号： C22C5/02 ,  B23K35/3013 ,  H01L24/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/78306 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/01071 ,  H01L2924/00014 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/20752 ,  H01L2924/00013 ,  H01L2924/01006

摘要： [Issues to be solved]
Second bonding failures caused attached oxide of additive elements on high purity Au bonding wire are to be dissolved.
[Solution means]
Au alloy bonding wires comprising: 5 - 100 wt ppm Mg, 5 - 20 wt ppm In, 5 - 20 wt ppm Al, 5 - 20 wt ppm Yb, and Au residual is more than 99.995 wt % purity, and adding 5 - 20 wt ppm Ca, and for these alloys adding at least more than one element among 5 - 20 wt ppm La, 5 - 20 wt ppm Lu, 5 - 100 wt ppm Sn, 5 - 100 wt ppm Sr to the alloy, and/or, more over, adding 0.01 - 1.2 wt % Pd to these alloys. Bonding wire, which contains these trace additive elements .do not cause of disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding to attached on tip of capillary, transferring to the wire at second bonding.

摘要翻译： [要解决的问题]第二次键合失败导致高纯度Au键合线上的添加元素的附着氧化物被溶解。 [解决手段] Au合金接合线包括：5-100wt ppm Mg，5-20wt ppm In，5-20wt ppm Al，5-20wt ppm Yb和Au残余物，纯度大于99.995wt％，并且 添加5-20wtppm的Ca，并且对于这些合金，在合金中添加5-20wt ppm La，5-20wt ppm Lu，5-100wt ppm Sn，5-100wt ppm Sr中的至少一种以上元素 ，和/或更重要的是，向这些合金中加入0.01-1.2wt％的Pd。 包含这些微量添加元素的键合线不会由于积聚的污染而造成干扰，这是由于在微球形成时在球形成时和在第一次键合时形成的附着在毛细管尖端上的污染物，在第二键合时转移到线上 。

公开(公告)号：EP2413351A1

公开(公告)日：2012-02-01

申请号：EP09842303.1

申请日：2009-09-01

申请人： Tanaka Denshi Kogyo K.K.

发明人： YAMASHITA Tsutomu ,  AKIMOTO Hideyuki ,  KUWAHARA Takeshi ,  OKAZAKI Junichi

IPC分类号： H01L21/60

CPC分类号： B23K35/302 ,  B23K35/0261 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48664 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48864 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2224/85469 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01205 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/01015 ,  H01L2924/01206 ,  H01L2924/01029 ,  H01L2924/01204 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/0105 ,  H01L2224/45639 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45671 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/01007 ,  H01L2924/01006 ,  H01L2924/01078 ,  H01L2924/20755 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/01203 ,  H01L2924/01046 ,  H01L2924/20309 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01033

摘要： To provide a covered Cu wire for ball bonding which can be avoid inconvenience oxidation of core material of Cu and/or Cu alloy on ball forming after pulling and cutting away.
A covered Cu wire comprising: core material of Cu-P alloy, and intermediate layer of Pd or Pt on the core material and surface layer of Au on the intermediate layer.

摘要翻译： 提供用于球接合的覆盖Cu线，其可以避免在拉拔切割后的球形成中Cu和/或Cu合金的芯材料的不便氧化。 一种覆盖的Cu线，包括：Cu-P合金的芯材，以及在中间层上的芯材料和Au的表面层上的Pd或Pt的中间层。

公开(公告)号：EP2369023A1

公开(公告)日：2011-09-28

申请号：EP11004085.4

申请日：2008-09-11

申请人： Tanaka Denshi Kogyo K.K.

发明人： Murai, Hiroshi ,  Chiba, Jun

IPC分类号： C22C5/02 ,  H01L21/60 ,  B23K35/30 ,  H01L23/00

CPC分类号： C22C5/02 ,  B23K35/3013 ,  H01L24/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/78306 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/01071 ,  H01L2924/00014 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/20752 ,  H01L2924/00013 ,  H01L2924/01006

摘要： [Issues to be solved]
Second bonding failures caused attached oxide of additive elements on high purity Au bonding wire are to be dissolved.
[Solution means]
Au alloy bonding wires comprising:
0.01 - 1.2 wt % Pd,
5 - 100 wt ppm Mg,
5 - 20 wt ppm In,
5 - 20 wt ppm Al,
5 - 20 wt ppm Yb,
optionally 5 - 20 wt ppm Ca and/or at least more than one element among 5 - 20 wt ppm La, 5 - 20 wt ppm Lu, 5 - 100 wt ppm Sn, 5 - 100 wt ppm Sr,

the rest being Au having a purity greater than 99.99 wt %. Bonding wire, which contains these trace additive elements do not cause of disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding to attached on tip of capillary, transferring to the wire at second bonding.

摘要翻译： [待解决的问题]在高纯度Au接合线上引起附加元素的氧化物引起的第二次接合故障将被溶解。 [解决方案] Au合金接合线包括：0.01-1.2重量％的Pd，5-100重量ppm的Mg，5-20重量ppm的In，5-20重量ppm的Al，5-20重量ppm的Yb，任选的5-20重量％ 5至20重量ppm的La，5-20重量ppm的Lu，5-100重量ppm的Sn，5-100重量ppm的Sr中的至少一种元素和/或至少一种元素，其余的是纯度大于99.99的Au 重量％。 含有这些微量添加元素的接合线不会由于由于微量放电而形成的球形污染，并且在第一次接合而附着在毛细管尖端处的污染导致累积污染的干扰，在第二次接合时转移到导线。

公开(公告)号：EP2204846A1

公开(公告)日：2010-07-07

申请号：EP08790566.7

申请日：2008-06-23

申请人： Tanaka Denshi Kogyo K.K.

发明人： TAKADA, Mitsuo ,  TESHIMA, Satoshi ,  KUWAHARA, Takeshi

IPC分类号： H01L21/60 ,  C22C5/02

CPC分类号： H01L24/85 ,  B23K35/3013 ,  B23K2201/36 ,  C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20106 ,  H01L2924/20752 ,  Y10T428/12 ,  H01L2924/01012 ,  H01L2924/01063 ,  H01L2924/0105 ,  H01L2924/0102 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/00015 ,  H01L2924/01205 ,  H01L2924/01048 ,  H01L2924/00013 ,  H01L2924/01049 ,  H01L2924/01006

摘要： [PROBLEMS] To provide a gold alloy wire which is excellent in the property of forming a melt ball, suitability for stitch bonding, and wire strength and, despite this, gives a press-bonded ball having excellent circularity, and which is usable in high-density wiring for a semiconductor device. [MEANS FOR SOLVING PROBLEMS] The gold alloy wire for use in ball bonding is made of a gold alloy comprising 10-50 mass ppm magnesium (Mg), 5-20 mass ppm europium (Eu), 2-9 mass ppm calcium (Ca), and gold (Au) having a purity of 99.995 mass% or higher as the remainder, wherein the calcium (Ca) content is up to half the europium (Eu) content by mass.

摘要翻译： 本发明提供一种熔融球形成性优异，缝合适应性和线强度高的金合金丝，尽管如此，可提供圆形性优异的压接球，可高效使用 半导体器件的密度布线。 解决问题的手段用于球接的金合金线由含有10-50质量ppm镁（Mg），5-20质量ppm铕（Eu），2-9质量ppm钙（Ca ）和纯度为99.995质量％以上的金（Au）余量，其中钙（Ca）含量高达铕（Eu）含量的一半。

公开(公告)号：EP2139032A1

公开(公告)日：2009-12-30

申请号：EP08738890.6

申请日：2008-03-26

申请人： Tanaka Denshi Kogyo K.K.

发明人： MURAI, Hiroshi ,  CHIBA, Jun ,  AMADA, Fujio

IPC分类号： H01L21/60 ,  C22C5/02

CPC分类号： C22C5/02 ,  B23K35/0227 ,  B23K35/3013 ,  B23K2201/36 ,  B23K2203/10 ,  H01L24/02 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/4845 ,  H01L2224/48624 ,  H01L2224/85201 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20755 ,  H01L2924/20656 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2924/01006

摘要： [Issues to be solved]
Providing enhanced bonding reliability of Au alloy bonding wire with low electrical resistivity to Al electrode of semiconductor device, and its application of semiconductor device is bonded with Al electrode pad by the same wire.
[Solution means]
Au alloy bonding wire comprising: 0.02 - 0.3 mass % Ag, total amount of 10 - 200 mass ppm at least one element of Ge and/or Si, and/or total amount of 10 - 200 mass ppm at least one element of Al and/or Cu, with residual of Au. Moreover, Al and/or Al alloy pad bonded with the above Au alloy bonding wire.

摘要翻译： [要解决的问题]提供具有低电阻率的Au合金接合线与半导体器件的Al电极的接合可靠性提高，并且其半导体器件的应用通过同一导线与Al电极焊盘接合。 [解决手段]一种Au合金接合线，其特征在于，含有：Ag：0.02〜0.3质量％，Ge和/或Si中的至少一种元素的总量为10〜200质量ppm，和/或总量为10〜200质量ppm， Al和/或Cu元素，其余为Au。 而且，Al和/或Al合金衬垫与上述Au合金键合线结合。

公开(公告)号：EP2315240A1

公开(公告)日：2011-04-27

申请号：EP09804793.9

申请日：2009-05-01

申请人： Tanaka Denshi Kogyo K.K.

发明人： MIKAMI Michitaka ,  KIKUCHI Teruo ,  HIRATA Yuichi ,  NAKASHIMA Shinichiro ,  SATOU Matsumi ,  KIMURA Keisuke

IPC分类号： H01L21/60

CPC分类号： B21C37/047 ,  C22C21/00 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/432 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/4851 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01045 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/014 ,  H01L2924/01003 ,  H01L2924/01004 ,  H01L2924/01039 ,  H01L2224/45139 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01203 ,  H01L2924/01059 ,  H01L2924/20304 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20105 ,  H01L2924/01006

摘要： To provide a bonding ribbon which can be realized the stable bonding strength, which has a homogeneous whole bonded surface every time for several ten thousands bonding cycles.
An aluminum ribbon for ultrasonic bonding comprising: an aluminum alloy is more than 99 wt % of Al, it contains additive elements and residual aluminum, wherein it has ultra thin tape structure roll rolled after multi stages drawing, wherein the average crystal grain size at a cross section of the ribbon is 5 - 200 µm, wherein it is featured the ratio of the thickness to the width is 1/2 - 1/20.
It is preferable that the aspect ratio of crystal grain (width direction/thickness direction) is 0.5 - 10 and the surface of the tape is mirror-finished wherein the surface roughness R z is less than 2 µm and/or equals to 2 µm.

摘要翻译： 为了提供能够实现稳定的结合强度的粘合带，其每次具有均匀的整个粘结表面，可以进行数千个粘结循环。 一种超声波接合用铝带，其特征在于，铝合金的Al大于99重量％，含有添加元素和残留铝，其中，在多阶段拉伸之后，其具有超薄带结构辊轧，其中平均晶粒尺寸为 带的横截面为5-200μm，其特征在于厚度与宽度之比为1/2至1/20。 晶粒长宽比（宽度方向/厚度方向）优选为0.5〜10，并且表面粗糙度R z小于2μm和/或等于2μm的带的表面是优选的。

公开(公告)号：EP2209136A1

公开(公告)日：2010-07-21

申请号：EP08846626.3

申请日：2008-10-15

申请人： Tanaka Denshi Kogyo K.K.

发明人： TAKADA, Mitsuo ,  TESHIMA, Satoshi ,  KUWAHARA, Takeshi

IPC分类号： H01L21/60 ,  C22C5/02

CPC分类号： H01L24/85 ,  C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01105 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/01039 ,  H01L2924/00014 ,  H01L2924/01202 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00015 ,  H01L2924/01049 ,  H01L2924/01006

摘要： [Issues to be solved]
To provide Au alloy wire for ball bonding, which is superior wire strength, and also is superior at formability of molten ball and roundness of compressed ball, moreover is superior at stitch bondability; is available for high density wiring of semiconductor divices.
[Solution means]
Au alloy wire for ball bonding comprising: 15 - 50 wt ppm Mg, 10 - 30 wt ppm Ca, 5 - 20 wt ppm Eu, 5 - 20 wt ppm Y, 5 - 20 wt ppm La and residual Au is more than 99.998 wt % purity, moreover, purity of more than 99.98 wt % Au, mass of additive Ca is less than the value of total amount of additive Eu and additive La, and mass of additive Y is less than the value of total amount of additive Ca and additive Eu, and mass of 20 - 40 wt ppm Mg.