发明公开
EP2323159A1 Method of forming polycrystalline silicon layer, thin film transistor, organic light emitting diode display device having the same, and methods of fabricating the same
审中-公开
形成多晶硅层,薄膜晶体管,有机发光二极管显示装置及其制造方法,使得所述的方法
- 专利标题: Method of forming polycrystalline silicon layer, thin film transistor, organic light emitting diode display device having the same, and methods of fabricating the same
- 专利标题(中): 形成多晶硅层,薄膜晶体管,有机发光二极管显示装置及其制造方法,使得所述的方法
-
申请号: EP10191250.9申请日: 2010-11-15
-
公开(公告)号: EP2323159A1公开(公告)日: 2011-05-18
- 发明人: Lee, Dong-Hyun , Lee, Ki-Yong , Seo, Jin-Wook , Yang, Tae-Hoon , Lisachenko, Maxim , Park, Byoung-Keon , Lee, Kil-Won , Jung, Jae-Wan
- 申请人: Samsung Mobile Display Co., Ltd.
- 申请人地址: San No.24 Nongseo-Dong Giheung-Gu Yongin-city, Gyunggi-do 446-711 KR
- 专利权人: Samsung Mobile Display Co., Ltd.
- 当前专利权人: Samsung Mobile Display Co., Ltd.
- 当前专利权人地址: San No.24 Nongseo-Dong Giheung-Gu Yongin-city, Gyunggi-do 446-711 KR
- 代理机构: Walaski, Jan Filip
- 优先权: KR20090109835 20091113
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L21/336 ; H01L29/786 ; H01L21/77
摘要:
A method of forming a polycrystalline silicon layer, a thin film transistor (TFT), an organic light emitting diode (OLED) display device having the same, and methods of fabricating the same. The method of forming a polycrystalline silicon layer includes providing a substrate, forming a buffer layer on the substrate, forming an amorphous silicon layer on the buffer layer, forming a groove in the amorphous silicon layer, forming a capping layer on the amorphous silicon layer, forming a metal catalyst layer on the capping layer, and annealing the substrate and crystallizing the amorphous silicon layer into a polycrystalline silicon layer,
信息查询
IPC分类: