摘要:
A method of forming a polycrystalline silicon layer, a thin film transistor (TFT), an organic light emitting diode (OLED) display device having the same, and methods of fabricating the same. The method of forming a polycrystalline silicon layer includes providing a substrate, forming a buffer layer on the substrate, forming an amorphous silicon layer on the buffer layer, forming a groove in the amorphous silicon layer, forming a capping layer on the amorphous silicon layer, forming a metal catalyst layer on the capping layer, and annealing the substrate and crystallizing the amorphous silicon layer into a polycrystalline silicon layer,
摘要:
A thin film transistor, a method of fabricating the thin film transistor, and an organic light emitting diode (OLED) display device equipped with the thin film transistor, wherein the thin film transistor includes a substrate (100, 300), a buffer layer (110, 310) disposed on the substrate (100, 300), a first semiconductor layer (160, 340) and a second semiconductor layer (170, 350) disposed on the buffer layer (110, 310), a gate electrode (185, 320) insulated from the first semiconductor layer (160, 340) and the second semiconductor layer (170, 350), a gate insulating layer (180, 330) insulating the gate electrode (185, 320) from the first semiconductor layer (160, 340) and the second semiconductor layer (170, 350), and source and drain electrodes (200a, 200b, 360a, 360b) insulated from the gate electrode (185, 320), wherein the second semiconductor layer (170, 350) is disposed on the first semiconductor layer (160, 340) and is connected to one of the source and drain electrodes (200a, 200b, 360a, 360b).
摘要:
A method of forming a complimentary metal-oxide semiconductor (CMOS) having a p-type metal-oxide semiconductor (PMOS) and an n-type metal-oxide semiconductor (NMOS) comprises doping both the PMOS and the NMOS simultaneously with an impurity that getters remaining metal catalyst from the PMOS and forms a lightly doped drain region in the NMOS.
摘要:
A method of forming a complimentary metal-oxide semiconductor (CMOS) having a p-type metal-oxide semiconductor (PMOS) and an n-type metal-oxide semiconductor (NMOS) comprises doping both the PMOS and the NMOS simultaneously with an impurity that getters remaining metal catalyst from the PMOS and forms a lightly doped drain region in the NMOS.
摘要:
A thin film transistor, a method of fabricating the same, and an organic light emitting diode display device having the same, the thin film transistor including: a substrate; a silicon layer formed on the substrate; a diffusion layer formed on the silicon layer; a semiconductor layer that is crystallized using a metal catalyst, formed on the diffusion layer; a gate electrode disposed on the diffusion layer, facing a channel region of the semiconductor layer; a gate insulating layer disposed between the gate electrode and the semiconductor layer; and source and drain electrodes electrically connected to source and drain regions of the semiconductor layer.
摘要:
An organic light emitting diode (OLED) display device and a method of fabricating the same are provided. The OLED display device includes a substrate having a thin film transistor region and a capacitor region, a buffer layer disposed on the substrate, a gate insulating layer disposed on the substrate, a lower capacitor electrode disposed on the gate insulating layer in the capacitor region, an interlayer insulating layer disposed on the substrate, and an upper capacitor electrode disposed on the interlayer insulating layer and facing the lower capacitor electrode, wherein regions of each of the buffer layer, the gate insulating layer, the interlayer insulating layer, the lower capacitor electrode, and the upper capacitor electrode have surfaces in which protrusions having the same shape as grain boundaries of the semiconductor layer are formed. The resultant capacitor has an increased surface area, and therefore, an increased capacitance.
摘要:
A method of fabricating an organic light emitting diode (OLED) display device having a thin film transistor including a polysilicon layer. The method of fabricating a polysilicon layer includes forming a buffer layer on a substrate, forming a metal catalyst layer on the buffer layer, diffusing a metal catalyst into the metal catalyst layer to the buffer layer, removing the metal catalyst layer, forming an amorphous silicon layer on the buffer layer, and annealing the substrate to crystallize the amorphous silicon layer into a polysilicon layer. The thin film transistor includes a substrate, a buffer layer disposed on the substrate, a semiconductor layer disposed on the buffer layer, a gate insulating layer disposed above the substrate and on the semiconductor layer, a gate electrode disposed on the gate insulating layer, a source electrode and a drain electrode both electrically connected to the semiconductor layer, and a metal silicide disposed between the buffer layer and the semiconductor layer.
摘要:
A thin film transistor, a method of fabricating the thin film transistor, and an organic light emitting diode (OLEO) display device including the thin film transistor, the thin film transistor including: a substrate; a buffer layer formed on the substrate; a first semiconductor layer disposed on the buffer layer; a second semiconductor layer disposed on the first semiconductor layer, which is larger than the first semiconductor layer; a gate electrode insulated from the first semiconductor layer and the second semiconductor layer; a gate insulating layer to insulate the gate electrode from the first semiconductor layer and the second semiconductor layer; source and drain electrodes insulated from the gate electrode and connected to the second semiconductor layer; an insulating layer disposed on the source and drain electrodes, and an organic light emitting diode connected to one of the source and drain electrodes.
摘要:
A thin film transistor (TFT) and an organic light emitting diode (OLED) display device . The TFT and the OLED display device include a substrate (300), a buffer layer (310) disposed on the substrate (300), a semiconductor layer (320) disposed on the buffer layer (310), a gate electrode (340) insulated from the semiconductor layer (320), a gate insulating layer (330) insulating the semiconductor layer (320) from the gate electrode (340), and source and drain electrodes (360,361) insulated from the gate electrode (340) and partially connected to the semiconductor layer (320), wherein the semiconductor layer (320) is formed from a polycrystalline silicon layer (320a) crystallized by a metal catalyst wherefrom the metal catalyst is removed by gettering using an etchant. In addition, the OLED display device includes an insulating layer (365) disposed on the entire surface of the substrate (300), a first electrode (370) disposed on the insulating layer (365) and electrically connected to one of the source and drain electrodes (360,361), an organic layer (380), and a second electrode (385).
摘要:
A thin film transistor includes a substrate, a semiconductor layer disposed on the substrate, including a channel region and source and drain regions and crystallized using a metal catalyst, a gate electrode disposed to correspond to a predetermined region of the semiconductor layer, a gate insulating layer disposed between the gate electrode and the semiconductor layer to insulate the semiconductor layer from the gate electrode, and source and drain electrodes electrically connected to the source and drain regions of the semiconductor layer, respectively. The metal catalyst within 15 nm (150Å) from a surface of the semiconductor layer in a vertical direction is formed to have a concentration exceeding 0 and not exceeding 6.5 × 10 17 atoms per cm 3 in the channel region of the semiconductor layer. An organic light emitting diode (OLED) display device includes the thin film transistor.