发明公开
EP2369023A1 Bonding wire 审中-公开
Bonddraht

Bonding wire
摘要:
[Issues to be solved]
Second bonding failures caused attached oxide of additive elements on high purity Au bonding wire are to be dissolved.
[Solution means]
Au alloy bonding wires comprising:
0.01 - 1.2 wt % Pd,
5 - 100 wt ppm Mg,
5 - 20 wt ppm In,
5 - 20 wt ppm Al,
5 - 20 wt ppm Yb,
optionally 5 - 20 wt ppm Ca and/or at least more than one element among 5 - 20 wt ppm La, 5 - 20 wt ppm Lu, 5 - 100 wt ppm Sn, 5 - 100 wt ppm Sr,

the rest being Au having a purity greater than 99.99 wt %. Bonding wire, which contains these trace additive elements do not cause of disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding to attached on tip of capillary, transferring to the wire at second bonding.
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