发明公开
- 专利标题: Bonding wire
- 专利标题(中): Bonddraht
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申请号: EP11004085.4申请日: 2008-09-11
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公开(公告)号: EP2369023A1公开(公告)日: 2011-09-28
- 发明人: Murai, Hiroshi , Chiba, Jun
- 申请人: Tanaka Denshi Kogyo K.K.
- 申请人地址: Tokyo Building 22F 7-3 Marunouchi 2-chome Chiyoda-ku Tokyo 100-6422 JP
- 专利权人: Tanaka Denshi Kogyo K.K.
- 当前专利权人: Tanaka Denshi Kogyo K.K.
- 当前专利权人地址: Tokyo Building 22F 7-3 Marunouchi 2-chome Chiyoda-ku Tokyo 100-6422 JP
- 代理机构: Stona, Daniel
- 优先权: JP2007289091 20071106
- 主分类号: C22C5/02
- IPC分类号: C22C5/02 ; H01L21/60 ; B23K35/30 ; H01L23/00
摘要:
[Issues to be solved]
Second bonding failures caused attached oxide of additive elements on high purity Au bonding wire are to be dissolved.
[Solution means]
Au alloy bonding wires comprising:
0.01 - 1.2 wt % Pd,
5 - 100 wt ppm Mg,
5 - 20 wt ppm In,
5 - 20 wt ppm Al,
5 - 20 wt ppm Yb,
optionally 5 - 20 wt ppm Ca and/or at least more than one element among 5 - 20 wt ppm La, 5 - 20 wt ppm Lu, 5 - 100 wt ppm Sn, 5 - 100 wt ppm Sr,
the rest being Au having a purity greater than 99.99 wt %. Bonding wire, which contains these trace additive elements do not cause of disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding to attached on tip of capillary, transferring to the wire at second bonding.
Second bonding failures caused attached oxide of additive elements on high purity Au bonding wire are to be dissolved.
[Solution means]
Au alloy bonding wires comprising:
0.01 - 1.2 wt % Pd,
5 - 100 wt ppm Mg,
5 - 20 wt ppm In,
5 - 20 wt ppm Al,
5 - 20 wt ppm Yb,
optionally 5 - 20 wt ppm Ca and/or at least more than one element among 5 - 20 wt ppm La, 5 - 20 wt ppm Lu, 5 - 100 wt ppm Sn, 5 - 100 wt ppm Sr,
the rest being Au having a purity greater than 99.99 wt %. Bonding wire, which contains these trace additive elements do not cause of disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding to attached on tip of capillary, transferring to the wire at second bonding.
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