发明公开
EP2434297A1 STRUCTURE HAVING CHIP MOUNTED THEREON AND MODULE PROVIDED WITH THE STRUCTURE
审中-公开
结构安装了芯片，模块提供了结构
- 专利标题： STRUCTURE HAVING CHIP MOUNTED THEREON AND MODULE PROVIDED WITH THE STRUCTURE
- 专利标题（中）： 结构安装了芯片，模块提供了结构
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申请号： EP09844914.3申请日： 2009-05-21
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公开(公告)号： EP2434297A1公开(公告)日： 2012-03-28
- 发明人: HAYASHI, Shintarou , UEDA, Mitsuhiko , SANAGAWA, Yoshiharu , SAKAI, Takamasa
- 申请人： Panasonic Corporation
- 申请人地址： 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 JP
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 JP
- 代理机构： Strehl Schübel-Hopf & Partner
- 国际公布： WO2010134181 20101125
- 主分类号： G01P15/08
- IPC分类号： G01P15/08 ; G01P15/12 ; G01P15/18 ; H01L29/84 ; H01L21/60
摘要：
A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is applied to the upper surface of the base. The chip has a rectangular shape to have a width and a length, and is bonded at its lower surface to the base. The adhesive agents comprises the first adhesive agent, the second adhesive agent, and the third adhesive agent which are disposed on the three spots of the upper surface of the base, respectively. The three spots on the base are located on vertexes of a triangle. The first chip is bonded to the base by only the first adhesive agent, the second adhesive agent, and the third adhesive agent.
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