发明公开
- 专利标题: BONDING MATERIAL AND BONDING METHOD USING SAME
- 专利标题(中): 装订材料和方法,以便粘结剂
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申请号: EP10847952申请日: 2010-04-23
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公开(公告)号: EP2548678A4公开(公告)日: 2015-11-25
- 发明人: ENDOH KEIICHI , HISAEDA YUTAKA , MIYAZAWA AKIHIRO , NAGAHARA AIKO , UEYAMA TOSHIHIKO
- 申请人: DOWA ELECTRONICS MATERIALS CO
- 专利权人: DOWA ELECTRONICS MATERIALS CO
- 当前专利权人: DOWA ELECTRONICS MATERIALS CO
- 优先权: JP2010058370 2010-03-15
- 主分类号: B22F1/00
- IPC分类号: B22F1/00 ; B22F1/02 ; B22F7/06 ; B22F9/24 ; B23K1/00 ; B23K35/00 ; B23K35/36 ; B82Y30/00 ; C22C5/06 ; H01B1/02 ; H01L21/52 ; H01L23/00 ; H05K3/32
摘要:
A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300°C or lower.
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